Abstract
The three major structural elements making up a populated circuit card in electronics packaging are the module, leads, and the printed circuit card. “Module” as a generic name will be used in this book for all sorts of components attached to a circuit card. For their mechanical roles, featured in this book, modules are characterized by elastic, mass and strength properties. Some of these properties, along with the test procedures followed to obtain them, are considered in this chapter. Special attention is paid to solder, the ubiquitous material of interconnections. Plated through holes of multilayer circuit boards will be treated in Chapter 13. Mass considerations will be included in Chapter 12, in connection with dynamic effects.
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© 1993 Springer Science+Business Media New York
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Engel, P.A. (1993). Components, Data, and Testing. In: Structural Analysis of Printed Circuit Board Systems. Mechanical Engineering Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4612-0915-7_3
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DOI: https://doi.org/10.1007/978-1-4612-0915-7_3
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