Abstract
In the previous chapter we discussed an approximate engineering approach founded on the premise that corner leads alone carry stress between module and card. The validity of this idealization deteriorates with decreasing lead spacing and lead stiffness and with increasing module stiffness.
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References
Engel, P.A., and Ling, Y. (1992), “Torsion of Elastically Coupled Plates with Applications to Electronic Packaging,” Proc. ASME/JSME Electronics Packaging Conf., Milpitas, Calif. pp. 575–581.
Engel, P.A., and Vogelmann, J.T. (1992), “Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion,” ASME J. Elec. Packag., 114(2), 203–210.
Engel, P.A., and Miller, T.M. (1992), “Torsional Stiffness and Fatigue Testing of Surface Mounted Compliant Leaded Systems,” Proc. 42nd ECTC Conf., San Diego, Calif., pp. 557–562.
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© 1993 Springer Science+Business Media New York
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Engel, P.A. (1993). Analytical Theory and Experimental Work in Compliant Leaded Systems Subjected to Twisting. In: Structural Analysis of Printed Circuit Board Systems. Mechanical Engineering Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4612-0915-7_10
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DOI: https://doi.org/10.1007/978-1-4612-0915-7_10
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4612-6945-8
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