Skip to main content

Effect of Imperfect Interface on a Thermal Inclusion with an Interior Radial Crack

  • Chapter
Integral Methods in Science and Engineering
  • 404 Accesses

Abstract

In electronic packaging and in the manufacture of fiber-reinforced composites, failure due to fiber cracking caused by thermal mismatch residual stresses is of major concern. Thermal stresses are caused by thermal mismatch between the inclusion and the surrounding matrix due to a uniform change in temperature. Most of the previous works in the area of interaction between a crack and an inclusion have assumed a perfect interface (see, for example, [1]–[4] and [5]). However, in practical problems it is known that the bond between fibers and the matrix material is often imperfect.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 54.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. G. Anlas and M.H. Santare, Arbitrarily oriented crack inside an elliptical inclusion, J. Appl. Mech. 60 (1993), 589–594.

    Article  MATH  Google Scholar 

  2. C. Atkinson, The interaction between a crack and an inclusion, Internat. J. Engng. Sci. 10 (1972), 127–136.

    Article  Google Scholar 

  3. J. Dundurs and G.P. Sendeckyj, Edge dislocation inside a circular inclusion, J. Mech. Phys. Solids13 (1965), 141–147.

    Article  Google Scholar 

  4. F. Erdogan, G.D. Gupta, and M. Ratwani, Interaction between a circular inclusion and an abitrarily oriented crack, J. Appl. Mech. 41 (1974), 1007–1013.

    Article  MATH  Google Scholar 

  5. O. Tamate, The effect of a circular inclusion on the stresses around a line crack in a sheet under tension, Internat. J. Fracture Mech. 4 (1968), 257–265.

    Google Scholar 

  6. C.Q. Ru, Effect of interphase layers on thermal stresses within an elliptical inclusion, J. Appl. Phys. 84 (1998), 4872–4879.

    Article  Google Scholar 

  7. N.I. Muskhelishvili, Some basic problems of the mathematical theory of elasticity, 3rd ed., P. Noordhoff, Groningen, 1949.

    Google Scholar 

  8. J.D. Achenbach and H. Zhu, Effect of inter facial zone on mechanical behavior and failure of fibre-reinforced composites, J. Mech. Phys. Solids37 (1989), 381–393.

    Article  Google Scholar 

  9. C.Q. Ru, Stress analysis of thermal inclusions with interior voids and cracks,ASME J. Electronic Packaging122 (2000), 192–199.

    Article  Google Scholar 

  10. S.M. Hu, Stress-related problems in silicon technology, J. Appl. Phys. 70 (1991), R53–R80.

    Article  Google Scholar 

Download references

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2002 Springer Science+Business Media New York

About this chapter

Cite this chapter

Amenyah, W. (2002). Effect of Imperfect Interface on a Thermal Inclusion with an Interior Radial Crack. In: Constanda, C., Schiavone, P., Mioduchowski, A. (eds) Integral Methods in Science and Engineering. Birkhäuser, Boston, MA. https://doi.org/10.1007/978-1-4612-0111-3_5

Download citation

  • DOI: https://doi.org/10.1007/978-1-4612-0111-3_5

  • Publisher Name: Birkhäuser, Boston, MA

  • Print ISBN: 978-1-4612-6617-4

  • Online ISBN: 978-1-4612-0111-3

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics