Thermal Stress Analysis of an Elliptic Inclusion with Imperfect Interface Embedded in an Infinite Elastic Medium

Abstract

Stresses induced by thermal mismatch are known to be a major cause of failure in a wide variety of composite materials and devices ranging from metal-ceramic composites to passivated interconnect lines in integrated circuits. One of the most effective procedures used to reduce these thermal stresses is the addition of a compliant intermediate or interphase layer between the different material components. In this chapter, we use the homogeneously imperfect interface model [1] to study the effect of a compliant interphase layer on thermal stresses in an elliptic elastic inclusion embedded within an infinite matrix under a uniform change in temperature. Both elastic mismatch and thermal mismatch will be considered.