Skip to main content

A Proposed Method for Design for Eco-Finance

  • Conference paper
  • First Online:
  • 2500 Accesses

Abstract

Products are becoming more complex to the extent that some elements of the design may be outsourced to multiple external vendors. Hence, any changes made during design activities can generate significant additional costs and time With high upfront design and development costs being common place specifically in low-volume high-value electronics production, the ability to accurately predict the anticipated financial burden of both these activities, and through-life production changes is of great importance to a business, especially in light of probable future influences such as environmentally driven legislation. The paper describes a new approach to address such issues, through the development of an Eco-Financial Decision Support System to help electronics companies provide rapid responses and quotations for the design and development of new or obsolescent products. These will be addressed through development towards ‘Design for Eco-Finance’ (DfEF), a new component of the DfX family, which will allow designers to perform a trade-off between environmental impacts and costs, supporting the financially viable, sustainable design of electronics products.

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   259.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   329.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD   329.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  • Charter M, Clark, T (2007) Key conclusions from sustainable innovation conferences 2003-2006. By the Centre for Sustainable Design, UK. Available via:

    Google Scholar 

  • http://www.cfsd.org.uk/Sustainable%20Innovation/Sustainable_Innovation_report.pdf [cited 14 June 2011]

  • Chen JL, Shih LH, Yang JS et al. (2005) Eco-design Activities in Taiwan. National Science Council of Taiwan, NSC Grant Reference: NSC93-262 1-Z006-009 and NSC93-22 12-E006-080.

    Google Scholar 

  • Cobley A, Mason T (2007) The evaluation of sonochemical techniques for sustainable surface modification in electronic manufacturing. Circuit World 33(3):29-34

    Google Scholar 

  • Curran R, Kundu A, Raghunathan S et al. D (2003) Influence of manufacturing tolerance on aircraft direct operating cost (DOC). Journal of Materials Processing Technology 138(1-3):208-213

    Google Scholar 

  • Curran R, Price M, Raghunathan S et al. (2005) Integrating aircraft cost modelling into conceptual design. Journal of Concurrent Engineering: Research and Applications 13(4):321-330

    Google Scholar 

  • Daoud W, Hassanzadeh M, Cornier A et al. (2007) Ecoselection of materials and process for medium voltage products. Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses, Proceedings of the 14th CIRP Conference on Life Cycle Engineering, Japan, June 11th-13th, 2007, Publisher: Springer London

    Google Scholar 

  • Eastman CM (1996) Design for X: concurrent engineering imperatives. Publisher: Springer. 1st edn. ISBN-10: 0412787504, ISBN-13: 978-0412787508

    Google Scholar 

  • Envirowise (2004) Sustainable design of electrical and electronic products to control costs and comply with legislation. Good Practice Guide, GG427.

    Google Scholar 

  • Huang Z, Conway PP, Jung E et al. (2006) Reliability issues in Pb-free solder joint miniaturization. Journal of Electronic Materials 35(9):1761-1772

    Google Scholar 

  • Jeswiet J, Hauschild M (2005) EcoDesign and future environmental impacts. Materials and Design, 26:629- 634

    Google Scholar 

  • Lee HB, Cho NW, Hong YS (2010) A hierarchical end-of-life decision model for determining the economic levels of remanufacturing and disassembly under environmental regulations. Journal of Cleaner Production 18:1276-1283

    Google Scholar 

  • Luttropp L, Lagerstedt J (2006) EcoDesign and the ten golden rules: generic advice for merging environmental aspects into product development. Journal of Cleaner Production 14(15-16):1396-1408

    Google Scholar 

  • Mellor W, Wright E, Clift R, et al. (2002) Mathematical model and decision support framework for material recovery, recycling and cascaded use. Chemical Engineering Science 57(22-23):4697-4713

    Google Scholar 

  • Mena C, Whicker L, Templar S et al. (2002) Costing the supply chain. Manufacturing Engineer 81(5):225-228

    Google Scholar 

  • Mills E, Shamshoian G, Blazek M et al. (2008) The business case for energy management in high-tech industries. Energy Efficiency Journal 1:5-20

    Google Scholar 

  • Newnes LB, Mileham AR, Cheung WM et al. (2008) Predicting the whole-life cost of a product at the conceptual design stage. Journal of Engineering Design 19(12):99-112

    Google Scholar 

  • SEEDA (2007) Sustainability appraisal RES implementation plan - A Scoping Report, February 2007, Available via: http://www.seeda.co.uk/RES/[Cited 14 June 2011]

    Google Scholar 

  • Segura-Velandia DM, Conway PP, West AA, Whalley DC, Wilson AR, Huertas-Quintero LAM (2007) Complex low volume electronics simulation tool to improve yield and reliability. The Proceedings of the 32nd IEEE Electronic Manufacturing Technology Symposium IEMT ‘07, San Jose, CA, USA, 3-5 Oct. 2007:1-7

    Google Scholar 

  • Sousa I, Wallace D (2006) Product classification to support approximate life-cycle assessment of design concepts. Technological Forecasting and Social Change 73(3):228-249

    Google Scholar 

  • Stevens GC, Herman H, Baird PJ (2007) Rapid assessment of electronic product enclosure plastics for improved resource management. Polymers in Electronics 2007 Munich:310-331

    Google Scholar 

  • Taurino R, Pozzi P, Zanasi T (2010) Facile characterization of polymer fractions from waste electrical and electronic equipment (WEEE) for mechanical recycling. Waste Management 30(12):2601-2607

    Google Scholar 

  • The Singapore Green Plan 2012 (2006) Available via: http://www.mewr.gov.sg/sgp2012 [Cited 14 June 2011]

  • Treasury HM (2006) The climate change levy package, Available via: http://www.hm-treasury.gov.uk/d/bud06_climate_169.pdf [Cited 23 July 2011]

  • Trimingham RL (2010) Co2ncept: Carbon footprinting for design concepts. EPSRC Grant Reference: (Lboro) EP/H022422/1

    Google Scholar 

  • Wiggins A (2010) Manufacturing electronic devices using embossing and microcontact printing. the Innovative electronics Manufacturing Research Centre (IeMRC) (GR/T07459/01)

    Google Scholar 

  • Zhang HC, Li J, Shrivastava P, Whitley A (2004) A web-based system for reverse manufacturing and product environmental impact assessment considering end-of-life dispositions. CIRP Annals - Manufacturing Technology 53(1): 5-8

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to E. L. Rosamond .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2013 Springer-Verlag London

About this paper

Cite this paper

Rosamond, E.L., Cheung, W.M. (2013). A Proposed Method for Design for Eco-Finance. In: Stjepandić, J., Rock, G., Bil, C. (eds) Concurrent Engineering Approaches for Sustainable Product Development in a Multi-Disciplinary Environment. Springer, London. https://doi.org/10.1007/978-1-4471-4426-7_40

Download citation

  • DOI: https://doi.org/10.1007/978-1-4471-4426-7_40

  • Published:

  • Publisher Name: Springer, London

  • Print ISBN: 978-1-4471-4425-0

  • Online ISBN: 978-1-4471-4426-7

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics