Abstract
An experimental apparatus is set up to test the heat transfer performance of the new radiator, which mainly includes vacuum-pumping and Central Processing Unit tunnel system, heating system and measurement system. The heat dissipation of the Central Processing Unit chip is imitated by the copper bar which is heated by thermal resistance wire. The experimental results showed that the temperature of the Central Processing Unit chip decreased with growth of cooling air velocity, but the temperature drop tendency became gentle when it continued to increase. Higher heat dissipation power resulted in higher CPU chip temperature, but oversized heat flux density made the phase changing process worse.
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© 2012 Springer-Verlag London Limited
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Xu, S. (2012). Numerical Simulation of New Radiator in Electronic Device. In: Wang, X., Wang, F., Zhong, S. (eds) Electrical, Information Engineering and Mechatronics 2011. Lecture Notes in Electrical Engineering, vol 138. Springer, London. https://doi.org/10.1007/978-1-4471-2467-2_40
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DOI: https://doi.org/10.1007/978-1-4471-2467-2_40
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Publisher Name: Springer, London
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Online ISBN: 978-1-4471-2467-2
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