Abstract
The parallelepiped problem is frequently encountered in the cure of thermosets. An analytical solution exists only when no reaction occurs in the resin and the thermal parameters are constant, for particular initial and boundary conditions. The problem is thus treated in a general way by considering heat transfer by conduction through the resin and heat evolved from the cure reaction. In this general case, the thermal parameters are temperature-dependent.
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© 1992 Springer-Verlag London Limited
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Vergnaud, JW., Bouzon, J. (1992). Numerical Analysis for a Parallelepiped with Three-Dimensional Heat Transfer and Cure Reaction. In: Cure of Thermosetting Resins. Springer, London. https://doi.org/10.1007/978-1-4471-1915-9_10
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DOI: https://doi.org/10.1007/978-1-4471-1915-9_10
Publisher Name: Springer, London
Print ISBN: 978-1-4471-1917-3
Online ISBN: 978-1-4471-1915-9
eBook Packages: Springer Book Archive