Abstract
Preliminary research work indicated the potential of using fusion bonding for joining TPMCs and metal substrates (Section 2.4.2.2, Table 2.6). The specific difficulties associated with high thermal conductivity in metal substrates and accompanying temperature non-uniformity were identified (McKnight et al., 1993a, b). The lack of processing windows has limited the application of fusion bonding for joining TPMCs with metal substrates. No processing window for resistance welding of metal substrates was available in the literature (Marinelli and Lambing, 1994).
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© 2002 Springer-Verlag London
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Ageorges, C., Ye, L. (2002). Fusion Bonding of Metal/TPMC Joints. In: Fusion Bonding of Polymer Composites. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/978-1-4471-0171-0_9
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DOI: https://doi.org/10.1007/978-1-4471-0171-0_9
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