Abstract
Relatively little research work is available in the literature about fusion bonding of TSMCs and TPMCs (Section 2.4.3). (1994) and (1994) in their preliminary work on resistance welding of TSMC/TPMC joints identified the need for further investigation of:
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• the thermal degradation occurring in TS substrates subjected to the relatively high temperature required to melt the TP polymer during welding;
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• the lack of processing windows for fusion bonding of TSMC/TPMC j oints.
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References
Don, R.C., McKnight, S.H., Wetzel, D., Gillespie Jr, lW., 1994 Application of Thermoplastic Resistance Welding Techniques to Thermoset Composites. In: Proceedings ofthe 52nd Annual Technical Conference (ANTEC′94), 1295–1297.
Kreith, F., 1973. Principles ofHeat Transfer, 3rd Edition, Intext Educational Publishers.
Wetzel, E.D., Don, R.C., Gillespie Jr, lW., 1994. Modeling Thermal Degradation during Thermoplastic Fusion Bonding of Thermoset Composites. In: Proceedings of the 52nd Annual Technical Conference (ANTEC′94) (1), 1263–1268.
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© 2002 Springer-Verlag London
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Ageorges, C., Ye, L. (2002). Fusion Bonding of TSMC/TPMC Joints. In: Fusion Bonding of Polymer Composites. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/978-1-4471-0171-0_8
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DOI: https://doi.org/10.1007/978-1-4471-0171-0_8
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