Fusion Bonding of TSMC/TPMC Joints

  • C. Ageorges
  • L. Ye
Part of the Engineering Materials and Processes book series (EMP)


Relatively little research work is available in the literature about fusion bonding of TSMCs and TPMCs (Section 2.4.3). (1994) and (1994) in their preliminary work on resistance welding of TSMC/TPMC joints identified the need for further investigation of:
  • • the thermal degradation occurring in TS substrates subjected to the relatively high temperature required to melt the TP polymer during welding;

  • • the lack of processing windows for fusion bonding of TSMC/TPMC j oints.


Thermal Degradation Processing Window Welding Time Mechanical Interlocking Welding Operation 
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  1. Don, R.C., McKnight, S.H., Wetzel, D., Gillespie Jr, lW., 1994 Application of Thermoplastic Resistance Welding Techniques to Thermoset Composites. In: Proceedings ofthe 52nd Annual Technical Conference (ANTEC′94), 1295–1297.Google Scholar
  2. Kreith, F., 1973. Principles ofHeat Transfer, 3rd Edition, Intext Educational Publishers.Google Scholar
  3. Wetzel, E.D., Don, R.C., Gillespie Jr, lW., 1994. Modeling Thermal Degradation during Thermoplastic Fusion Bonding of Thermoset Composites. In: Proceedings of the 52nd Annual Technical Conference (ANTEC′94) (1), 1263–1268.Google Scholar

Copyright information

© Springer-Verlag London 2002

Authors and Affiliations

  • C. Ageorges
    • 1
  • L. Ye
    • 2
  1. 1.DaimlerChrysler AGResearch and Technology/Manufacturing TechnologyUlmGermany
  2. 2.Centre for Advanced Materials Technology, School of Aerospace, Mechanical and Mechatronic EngineeringThe University of SydneyAustralia

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