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Low-Temperature Materials Properties

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Helium Cryogenics

Part of the book series: International Cryogenics Monograph Series ((ICMS))

Abstract

Before delving into the fluids and processes associated with helium cryogenics, it is important to first have a working knowledge of the relevant properties of other materials at low temperatures. This knowledge is valuable in part because materials have behavior that must be taken into account when considering the problems of refrigeration, heat transfer, or storage of low temperature helium. In addition as seen in subsequent chapters, many of the properties of helium are understood in terms of physical models that were primarily developed to treat the properties of different materials at low temperatures.

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  • R. Berman, Thermal Conduction in Solids, Clarendon Press, Oxford, 1976.

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  • K. Huang, Statistical Mechanics, J. Wiley & sons, NY, 1963.

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  • Y. Iwasa, Case Studies in Superconducting Magnets, Plenum Press, New York, 1994.

    Google Scholar 

  • C. Kittel, Introduction to Solid State Physics, 5th Ed., Wiley, New York, 1976.

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  • R. S. Krishnan, R. Srinivasan, and S. Dcvanarayanan, Thermal Expansion of Crystals, Pergamon, Oxford, 1979.

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  • E. A. Lynton, Superconductivity, 3rd Ed., Chapman Hall Ltd. Science Paperbacks, London, 1969.

    Google Scholar 

  • G. T. Meaden, Electrical Resistance of Metals, Plenum Press, New York, 1965.

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  • C. Rose-Innes and E. H. Rhoderick, Introduction to Superconductivity, 2nd Ed., International Series in Solid State Physics, Vol. 6, Pergamon Press, New York, 1978.

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  • M. N. Wilson, Superconducting Magnets, Monographs on Cryogenics, Clarendon Press, Oxford, 1983.

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Authors and Affiliations

  1. Field Laboratory, Florida State University, Tallahassee, FL, 32310, USA

    Steven W. Van Sciver

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  1. Steven W. Van Sciver
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Correspondence to Steven W. Van Sciver .

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Van Sciver, S.W. (2012). Low-Temperature Materials Properties. In: Helium Cryogenics. International Cryogenics Monograph Series. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-9979-5_2

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  • DOI: https://doi.org/10.1007/978-1-4419-9979-5_2

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4419-9978-8

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