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Integration Issues and Challenges

  • Pushkar Jain
  • Eugene J. Rymaszewski
Chapter

Abstract

Although the thin-film embedded capacitors have been realized in the prototype quantities, there are several challenging issues for their product applications. Specifically, a successful integration of these capacitors at onchip and/or off-chip levels requires their compatibility, reliability, and interaction (diffusion and/or reaction) with the metal interconnections and their insulators. This chapter discusses many of the key issues and challenges for the integration of thin film capacitors.

Keywords

None None Leakage Current Density Mobile Charge Package Electronics Integration Issue 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2004

Authors and Affiliations

  • Pushkar Jain
    • 1
  • Eugene J. Rymaszewski
    • 1
  1. 1.Rensselaer Polytechnic InstituteTroyUSA

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