Abstract
Surface acoustic wave (SAW) dispersion studies on the layered Cu/Si structures for the elastic characterization have been performed by scanning acoustic microscopy (SAM). The bonding quality at the interface has been also evaluated by examining the SAW dispersion changes. We have proposed an interface layer modeling approach to interpret the experimental results and to examine the elastic properties at the interface. The studies have shown that the behaviors of Sezawa wave is very sensitive to the interface properties and the bonding conditions in the used samples.
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References
Z.Yu and S.Boseck, Scanning acoustic microscopy and its applications to material characterization, Reviews of Modern Physics. 67:863(1995).
J.Li, Y.Shacham-Diamand and J.W.Mayer, Copper deposition and thermal stability issues in copper-based metallization for ULSI technology, Materials Science Reports. 9:1(1992).
R.D.Weglein, Acoustic micro-metrology, IEEE Trans. Sonics Ultrason. SU-32:225 (1985).
R.D.Weglein, Acoustic material signature extension, Electronics Letters. 32:30(1996).
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© 1997 Springer Science+Business Media New York
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Yu, Z., Boseck, S. (1997). Surface Acoustic Wave Dispersion Studies on the Layered CU/SI Structure Using Scanning Acoustic Microscopy. In: Lees, S., Ferrari, L.A. (eds) Acoustical Imaging. Acoustical Imaging, vol 23. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-8588-0_3
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DOI: https://doi.org/10.1007/978-1-4419-8588-0_3
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-4640-1
Online ISBN: 978-1-4419-8588-0
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