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Introduction to Thermal Design of Electronic Equipment

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Advanced Thermal Design of Electronic Equipment

Abstract

Electronic devices produce heat as a byproduct of normal operation. Besides the damage that excess heat can cause, it also increases the movement of free electrons in a semiconductor, which can cause an increase in signal noise. The primary focus of this book is to examine various ways to reduce the temperature of a semiconductor, or group of semiconductors. If we do not allow the heat to dissipate, the device junction temperature will exceed the maximum safe operating temperature specified by the manufacturer. When a device exceeds the specified temperature, semiconductor performance, life, and reliability are tremendously reduced, as shown in Figure 1.1. Researchers estimate that every 10°C increase in junction temperature reduces the semiconductor life by 50%. The basic objective, then, is to hold the junction temperature below the maximum temperature specified by the semiconductor manufacturer.

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© 1998 Springer Science+Business Media Dordrecht

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Remsburg, R. (1998). Introduction to Thermal Design of Electronic Equipment. In: Advanced Thermal Design of Electronic Equipment. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-8509-5_1

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  • DOI: https://doi.org/10.1007/978-1-4419-8509-5_1

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-4633-3

  • Online ISBN: 978-1-4419-8509-5

  • eBook Packages: Springer Book Archive

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