Introduction to Thermal Design of Electronic Equipment

  • Ralph Remsburg
Chapter

Abstract

Electronic devices produce heat as a byproduct of normal operation. Besides the damage that excess heat can cause, it also increases the movement of free electrons in a semiconductor, which can cause an increase in signal noise. The primary focus of this book is to examine various ways to reduce the temperature of a semiconductor, or group of semiconductors. If we do not allow the heat to dissipate, the device junction temperature will exceed the maximum safe operating temperature specified by the manufacturer. When a device exceeds the specified temperature, semiconductor performance, life, and reliability are tremendously reduced, as shown in Figure 1.1. Researchers estimate that every 10°C increase in junction temperature reduces the semiconductor life by 50%. The basic objective, then, is to hold the junction temperature below the maximum temperature specified by the semiconductor manufacturer.

Keywords

Combustion Entropy Fatigue Convection Enthalpy 

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References

  1. 1.
    Zienkiewicz, O. C., and Morgan, K., Finite Elements and Approximation, John Wiley, New York, 1983.MATHGoogle Scholar
  2. 2.
    Baker, A. J., Computation of Fluid Flow by the Finite Element Method, McGrawHill, New York, 1984.Google Scholar
  3. 3.
    Shih, T. M., Numerical Heat Transfer, Hemisphere, New York, 1984.MATHGoogle Scholar
  4. 4.
    Anderson, D. A., Tannehill, J. C., and Pletcher, R.H., Computational Fluid Mechanics and Heat Transfer, Hemisphere, New York, 1985.Google Scholar
  5. 5.
    Pantankar, S. V., Numerical Heat Transfer and Fluid Flow, Hemisphere, New York, 1980.Google Scholar
  6. 6.
    Launder, B. E., and Spalding, D.B., Lectures on Mathematical Models of Turbulence, Academic Press, London and New York, 1972.Google Scholar
  7. 7.
    Markatos, N.C., “Computer Simulation Techniques for Turbulent Flows,” in Encyclopedia of Fluid Mechanics, Vol. 6, N.P. Cheremisinoff (ed.), Gulf, June 1984, Journal of Appi Math. Modeling, No. 10, June 1986.Google Scholar
  8. 8.
    Rai, M. M., and Moin, P., “Direct Numerical Simulation of Transition and Turbulence in a Spatially Evolving Boundary Layer,” AIAA paper 91-1607-CP, Proc. AIAA 10 th Comput. Fluid Dynamics Conf., 890–914, (1991).Google Scholar
  9. 9.

Copyright information

© Springer Science+Business Media Dordrecht 1998

Authors and Affiliations

  • Ralph Remsburg
    • 1
  1. 1.Electronic Packaging Associates, Inc.SarasotaUSA

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