Abstract
Electronic devices produce heat as a byproduct of normal operation. Besides the damage that excess heat can cause, it also increases the movement of free electrons in a semiconductor, which can cause an increase in signal noise. The primary focus of this book is to examine various ways to reduce the temperature of a semiconductor, or group of semiconductors. If we do not allow the heat to dissipate, the device junction temperature will exceed the maximum safe operating temperature specified by the manufacturer. When a device exceeds the specified temperature, semiconductor performance, life, and reliability are tremendously reduced, as shown in Figure 1.1. Researchers estimate that every 10°C increase in junction temperature reduces the semiconductor life by 50%. The basic objective, then, is to hold the junction temperature below the maximum temperature specified by the semiconductor manufacturer.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Zienkiewicz, O. C., and Morgan, K., Finite Elements and Approximation, John Wiley, New York, 1983.
Baker, A. J., Computation of Fluid Flow by the Finite Element Method, McGrawHill, New York, 1984.
Shih, T. M., Numerical Heat Transfer, Hemisphere, New York, 1984.
Anderson, D. A., Tannehill, J. C., and Pletcher, R.H., Computational Fluid Mechanics and Heat Transfer, Hemisphere, New York, 1985.
Pantankar, S. V., Numerical Heat Transfer and Fluid Flow, Hemisphere, New York, 1980.
Launder, B. E., and Spalding, D.B., Lectures on Mathematical Models of Turbulence, Academic Press, London and New York, 1972.
Markatos, N.C., “Computer Simulation Techniques for Turbulent Flows,” in Encyclopedia of Fluid Mechanics, Vol. 6, N.P. Cheremisinoff (ed.), Gulf, June 1984, Journal of Appi Math. Modeling, No. 10, June 1986.
Rai, M. M., and Moin, P., “Direct Numerical Simulation of Transition and Turbulence in a Spatially Evolving Boundary Layer,” AIAA paper 91-1607-CP, Proc. AIAA 10 th Comput. Fluid Dynamics Conf., 890–914, (1991).
Flomerics, http://www.flotherm.com
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Remsburg, R. (1998). Introduction to Thermal Design of Electronic Equipment. In: Advanced Thermal Design of Electronic Equipment. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-8509-5_1
Download citation
DOI: https://doi.org/10.1007/978-1-4419-8509-5_1
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4613-4633-3
Online ISBN: 978-1-4419-8509-5
eBook Packages: Springer Book Archive