Abstract
We stated in Chapter 19 that heat conduction can be described as the transfer of thermal energy from the hot to the cold part of a piece of material. We shall discuss now the mechanisms which are involved in this transfer of thermal energy.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2011 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Hummel, R.E. (2011). Thermal Conduction. In: Electronic Properties of Materials. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-8164-6_21
Download citation
DOI: https://doi.org/10.1007/978-1-4419-8164-6_21
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4419-8163-9
Online ISBN: 978-1-4419-8164-6
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)