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Impedance Characteristics of Multi-Layer Grids

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Book cover Power Distribution Networks with On-Chip Decoupling Capacitors

Abstract

In July 1958, Jack Kilby of Texas Instruments suggested building all of the components of a circuit completely in silicon [1]. By September 12, 1958, Kilby had built a working model of the first “solid circuit,” the size of a pencil point. A couple of months later in January 1959, Robert Noyce of Fairchild Semiconductor developed a better way to connect the different components of a circuit [2], [3]. Later, in the spring of 1959, Fairchild Semiconductor demonstrated the first planar circuit — a “unitary circuit.” The first monolithic integrated circuit (IC) was born, where multiple transistors coexisted with passive components on the same physical substrate [4].

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© 2011 Springer New York

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Jakushokas, R., Popovich, M., Mezhiba, A.V., Köse, S., Friedman, E.G. (2011). Impedance Characteristics of Multi-Layer Grids. In: Power Distribution Networks with On-Chip Decoupling Capacitors. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7871-4_24

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  • DOI: https://doi.org/10.1007/978-1-4419-7871-4_24

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