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Inductance Model of Interdigitated Power and Ground Distribution Networks

  • Renatas Jakushokas
  • Mikhail Popovich
  • Andrey V. Mezhiba
  • Selçuk Köse
  • Eby G. Friedman
Chapter

Abstract

In July 1958, Jack Kilby of Texas Instruments suggested building all of the components of a circuit completely in silicon [1]. By September 12, 1958, Kilby had built a working model of the first “solid circuit,” the size of a pencil point. A couple of months later in January 1959, Robert Noyce of Fairchild Semiconductor developed a better way to connect the different components of a circuit [2], [3]. Later, in the spring of 1959, Fairchild Semiconductor demonstrated the first planar circuit — a “unitary circuit.” The first monolithic integrated circuit (IC) was born, where multiple transistors coexisted with passive components on the same physical substrate [4].

Keywords

Distribution Network Mutual Inductance Inductance Model Loop Inductance Ground Line 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer New York 2011

Authors and Affiliations

  • Renatas Jakushokas
    • 1
  • Mikhail Popovich
    • 2
  • Andrey V. Mezhiba
    • 3
  • Selçuk Köse
    • 1
  • Eby G. Friedman
    • 1
  1. 1.University of RochesterRochesterUSA
  2. 2.Qualcomm IncorporatedSan DiegoUSA
  3. 3.Intel CorporationHillsboroUSA

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