Abstract
Advanced electronic packaging materials play a key role in the proper functioning and useful life of the packaged electronic assembly. These functions mainly include electrical conduction, electrical insulation, mechanical support and structural profiles, environmental protection, as well as thermal conduction and dissipation. Therefore, electronic packaging materials shall possess required electrical, mechanical, thermal, chemical, and physical properties to provide the electronic system with excellent performance and reliable functions. For example, metals provide the means for conducting signals throughout the system via thin-film conductors, wires, interconnects, vias, etc.; insulating materials are used to prevent loss of signal currents by confining them to the metal path; structural or multifunctional materials are used to provide physical functions and mechanical support; and there are materials in which the primary function is for thermal dissipation or to prevent the system from the environment. This chapter will provide an overall review for the state of the art of high-performance electronic packaging materials and their thermal management functions, including properties of key materials, state of maturity, applications, processing, and future directions. These materials mainly include metallic materials, ceramics and semiconductors, electronic glasses, polymers, multimaterial laminates, printed circuit board (PCB) materials, thermal interconnection materials, low thermal conductivity materials, and advanced thermally conductive materials.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Ashby MF, Evans A, Fleck NA, Gibson LJ, Hutchinson JW, Wadley HNG (2000) Metal foams: a design guide. Butterworth-Heinemann, Boston.
Barcena J, Maudes J, Coleto J, Obieta I (2002) Novel copper/carbon nanofibers composites for high thermal conductivity electronic packaging. http://escies.org/GetFile?rsrcid=1691. Accessed 9 March 2010.
Bezama RJ, Casey JA, Pavelka JB, Pomerantz GA (1999) Method of forming a multilayer electronic packaging substrate with integral cooling channels. US Patent 5870823.
Brown WD, Ulrich R (2006) Materials for microelectronic packaging. In: Ulrich RK, Brown WD (eds) Advanced electronic packaging, 2nd edn. Wiley, Hoboken.
Casson KL et al (1997) Multilayer electronic circuit having a conductive adhesive. US Patent 5688584.
Castonguay RN (1974) Printed circuit board material incorporating binary alloys. US Patent 3857683.
Fackler WC (2002) Materials in electronic packaging. In: Kutz M (ed) Hand book of materials selection. Wiley, Hoboken.
Ferro (2008) Electronic material systems. http://www.ferro.com/non-cms/EMS/EPM/GLASSES/Product-Selection-and-Application.pdf. Accessed 3 March 2010.
Furness J (2008) Thermoplastics-material glossary. http://www.azom.com/details.asp?ArticleID=506. Accessed 6 March 2010.
Galasco RT, Lehman LP, Magnuson RH, Topa RD (2001) Biased acid cleaning of a copper–invar–copper laminate. US Patent 6179990.
Grensing FC (1992) Method of making beryllium-beryllium oxide composites. US Patent 5124119.
Haack DP, Butcher KR, Kim T, Lu TJ (2001) Novel lightweight metal foam heat exchangers. http://www.porvairadvancedmaterials.com/papers/Mech%20Engineer%20Congress%20Paper.pdf. Accessed 8 March 2010.
Hunt ML, Tien CL (1988) Effects of thermal dispersion on forced convection in fibrous media. Int J Heat Mass Transf 31: 301–309.
Hurley E, Rumer C, Christner R, Renfro T (2005) Metallic solder thermal interface material layer and application of the same. US Patent 0211752.
Lewis BG et al (2007) Thermal interface material and solder perform. US Patent 7187083.
Sampson RN, Mattox DM (1997) Materials for electronic packaging. In: Harper CA (ed) Electronics packaging & interconnection handbook, 2nd edn. McGraw-Hill, New York.
Suzuki T, Otagiri T, Kawai S, Ishikawa S (2002) Printed circuit board material and method of manufacturing board material and intermediate block body for board material. US Patent 6379781.
Taylor DA (2001) Advanced ceramics-the evolution, classification, properties, production, firing, finishing and design of advanced ceramics. Mater Aust 33(1): 20–22.
Wu K-M, Wu TJ (1996) Multimaterial fully isotropic laminates and multimaterial quasi-homogeneous anisotropic laminates. US Patent 5532040.
Young R et al (2006) Developments and trends in thermal management technologies – a mission to the USA. www.lboro.ac.uk/research/iemrc/documents/.../CB2007.pdf. Accessed 26 February 2010.
Zweben C (1998) Advances in composite materials for thermal management in electronic packaging. JOM. http://findarticles.com/p/articles/mi_qa5348/is_199806/ai_n21422924. Accessed 16 March 2010.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2011 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Tong, X.C. (2011). Electronic Packaging Materials and Their Functions in Thermal Managements. In: Advanced Materials for Thermal Management of Electronic Packaging. Springer Series in Advanced Microelectronics, vol 30. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7759-5_3
Download citation
DOI: https://doi.org/10.1007/978-1-4419-7759-5_3
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4419-7758-8
Online ISBN: 978-1-4419-7759-5
eBook Packages: EngineeringEngineering (R0)