Development and Application of Advanced Thermal Management Materials

  • Xingcun Colin Tong
Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 30)


As the demand for ease and access-speed increase, managing the thermal issues of the advanced electronic packaging would pose significant challenges. Each customer premise has its own special requirements that may complicate the required cooling scheme. The cooling constraints associated with customer premises impose stringent necessities on the component, board and system level power dissipation and cooling options. Together, these constraints create a set of opportunities and challenges that will dictate the thermal management requirements for the products for the next generation. In response to these needs, there have been revolutionary advances in thermal management materials and cooling approaches, such as low coefficient of thermal expansion (CTE), low-density materials with thermal conductivities up to 1,700 W/m K; increased reliability; reduced junction temperatures, reduced cost and weight; low CTE, thermally conductive printed circuit boards (PCBs), potentially eliminating the need for underfill; CTE matching allows direct attach with hard solders. There are a large and increasing number of microelectronic and optoelectronic applications with advanced thermal management technology, including: PCBs and PCB cold plates; heat sinks; microprocessor, RF (Radio Frequency) and power modules; heat spreaders and sinks; laser diode and light-emitting diode (LED) modules; thermoelectric coolers (TECs); plasma and liquid crystal displays (LCDs); detectors; and photovoltaics. This chapter covers the development roadmap of advanced thermal management materials, the growing array of applications, and future trends.


Heat Sink Heat Pipe Thermal Management Critical Heat Flux Junction Temperature 
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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.Laird TechnologiesSchaumburgUSA

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