Abstract
The semiconductor industry has showcased a spectacular exponential growth in the number of transistors per integrated circuit for several decades, as predicted by Moore’s law. Figure 1 shows the future technology trend predicted by ITRS (International Technology Roadmap for Semiconductors) [1]. By 2023, the physical gate length would scale down to 4.5 nm. Actually, according to a study [2], future devices could theoretically scale down to 1.5 nm with 0.04 ps switching speed and 0.017 eV energy consumption. However, maintaining such an exponential growth rate is a major challenge. Physical dimensions and electrostatic limitations faced by conventional process and fabrication technologies will likely thwart the dimensional scaling of complementary metal-oxide-semiconductor (CMOS) devices within the next decade. Figure 2 from ITRS shows that after 2016, the manufacturable solutions are unknown (the shaded area).
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International Technology Roadmap for Semiconductors, http://www.itrs.net/
V.V. Zhirnov, R.K. Cavin, J.A. Hutchby, and G.I. Bourianoff, “Limits to binary logic switch scaling: A Gedanken model,” Proc. IEEE 91(11):1934–1939, 2003.
T.-J. King, “FinFETs for nanoscale CMOS digital integrated circuits,” Proc. IEEE/ACM Int. Conf. Computer-Aided Design, San Diego, CA, pp. 207–210, 2005.
P. Beckett, “A fine-grained reconfigurable logic array based on double-gate transistors,” Proc. IEEE Int. Field-Programmable Technol. Conf., December 16–18, pp. 260–267, 2002.
K. Yuen, T. Man, and A.C.K. Chan, “A 2-bit MONOS nonvolatile memory cell based on double-gate asymmetric MOSFET structure,” IEEE Electron. Device Lett. 24:518–520, 2003.
A. Bhoj and N.K. Jha, “Pragmatic design of gated-diode FinFET DRAMs,” Proc. IEEE Int. Conf. Computer Design, Lake Tahoe, CA, October 4–7, 2009.
B. Swahn and S. Hassoun, “Gate sizing: FinFETs vs. 32-nm bulk MOSFETs,” Proc. Design Automation Conf., Lake Tahoe, CA, July 24–28, pp. 528–531, 2006.
C.-Y. Lee and N.K. Jha, “FinFET-based dynamic power management of on-chip interconnection networks through adaptive back-gate biasing,” Proc. IEEE Int. Conf. Computer Design, Lake Tahoe, CA, October 4–7, 2009.
S. Iijima, “Carbon nanotubes: Past, present, and future,” Phys. B 323(1–4):1–5, 2002.
J. Deng, N. Patil, K. Ryu, A. Badmaev, C. Zhou, S. Mitra, and H.-S. Wong, “Carbon nanotube transistor circuits: Circuit-level performance benchmarking and design options for living with imperfections,” Proc. IEEE Int. Solid-State Circuits Conf. (ISSCC), San Francisco, CA, pp. 586–588, 2007.
J. Guo, S. Datta, and M. Lundstrom, “Assessment of silicon MOS and carbon nanotube FET performance limits using a general theory of ballistic transistors,” Proc. IEEE Int. Electron Devices Meeting, pp. 711–714, 2002.
S.J. Kang et al., “High-performance electronics using dense, perfectly aligned arrays of single-walled carbon nanotubes,” Nat. Nanotechnol. 2(4):230–236, 2007.
N. Patil, A. Lin, E. Myers, H.S.-P. Wong, and S. Mitra, “Integrated wafer-scale growth and transfer of directional carbon nanotubes and misaligned-carbon-nanotube-immune logic structures,” Proc. Symp. VLSI Technology, Honolulu, HE, pp. 205–206, 2008.
W. Zhou, C. Rutherglen, and P. Burke, “Wafer-scale synthesis of dense aligned arrays of single-walled carbon nanotubes,” Nano Res. 1:158–165, 2008.
R. Martel, T. Schmidt, H.R. Shea, T. Hertel, and P. Avouris, “Single- and multi-wall carbon nanotube field-effect transistors,” Appl. Phys. Lett. 73(17):2447, 1998.
S.J. Tans, A.R.M. Verschueren, and C. Dekker, “Room-temperature transistor based on a single carbon nanotube,” Nature 393(6680):49–52, 1998.
A. Bachtold, P. Hadley, T. Nakanishi, and C. Dekker, “Logic circuits with carbon nanotube transistors,” Science 294(5545):1317–1320, 2001.
S.J. Wind, J. Appenzeller, R. Martel, V. Derycke, and P. Avouris, “Vertical scaling of carbon nanotube field-effect transistors using top gate electrodes,” Appl. Phys. Lett. 80(20):3817–3819, 2002.
S.J. Kang, C. Kocabas, T. Ozel, M. Shim, N. Pimparkar, M.A. Alam, S.V. Rotkin, and J.A. Rogers, “High-performance electronics using dense, perfectly aligned arrays of single-walled carbon nanotubes,” Nat. Nanotechnol. 2(4):230–236, 2007.
P.G. Collins, M.S. Arnold, and P. Avouris, “Engineering carbon nanotubes and nanotube circuits using electrical breakdown,” Science 292(5517):706–709, 2001.
N. Patil, A. Lin, J. Zhang, H. Wei, K. Anderson, H.-S.P. Wong, and S. Mitra, “VMR: VLSI-compatible metallic carbon nanotube removal for imperfection-immune cascaded multi-stage digital logic circuits using carbon nanotube FETs,” Proc. IEEE Int. Electron Devices Meeting, pp. 573–576, 2009.
A. Naeemi, R. Sarvari, and J.D. Meindl, “Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI),” IEEE Electron. Device Lett. 26:84–86, 2005.
N. Srivastava and K. Banerjee, “Performance analysis of carbon nanotube interconnects for VLSI applications,” Proc. IEEE Int. Conf. Computer-Aided Design, pp. 383–390, 2005.
A. Kawabata et al., “Carbon nanotube vias for future LSI interconnects,” Proc. IEEE Int. Interconnect Tech. Conf., pp. 251–253, June 2004.
X. Li et al., “Chemically derived, ultrasmooth graphene nanoribbon semiconductors,” Science 319(5867):1229–1232, 2008.
L. Jiao, L. Zhang, X. Wang, G. Diankov, and H. Dai, “Narrow graphene nanoribbons from carbon nanotubes,” Nature 458(7240):877–880, 2009.
K. Nakada and M. Fujita, “Edge state in graphene ribbons: Nanometer size effect and edge shape dependence,” Phys. Rev. B 54:17954–17961, 1996.
J.H. Chen, C. Jang, S. Xiao, M. Ishigami, and M.S. Fuhrer, “Intrinsic and extrinsic performance limits of graphene devices on SiO2,” Nat. Nanotechnol. 3(4):206–209, 2008.
H. Li, C. Xu, N. Srivastava, and K. Banerjee, “Carbon nanomaterials for next-generation interconnects and passives: Physics, status, and prospects,” IEEE Trans. Electron Devices: Special Issue on Compact Interconnect Models for Gigascale Integration 56(9):1799–1821, 2009.
K.S. Novoselov et al., “Electric field effect in atomically thin carbon films,” Science 306(5696):666–669, 2004.
M.Y. Han, B. Ozyilmaz, Y. Zhang, and P. Kim, “Energy band-gap engineering of graphene nanoribbons,” Phys. Rev. Lett. 98(20):206805, 2007.
Z. Chen, Y.-M. Lin, M.J. Rooks, and P. Avouris, “Graphene nano-ribbon electronics,” Physica E 40(2):228–232, 2007.
X. Wang, Y. Ouyang, X. Li, H. Wang, J. Guo, and H. Dai, “Room-temperature all-semiconducting sub-10-nm graphene nanoribbon field-effect transistors,” Phys. Rev. Lett. 100(20):206803–206907, 2008.
K. Nakada and M. Fujita,“Edge state in graphene ribbons: Nanometer size effect and edge shape dependence,” Phys. Rev. B 54:17954–17961, 1996.
Y.-W. Son, M.L. Cohen, and S.G. Louie, “Energy gaps in graphene nanoribbons,” Phys. Rev. Lett. 97(21):216803, 2006.
K.A. Ritter and J.W. Lyding, “The influence of edge structure on the electronic properties of graphene quantum dots and nanoribbons,” Nat. Mater. 8(3):235–242, 2009.
A.K. Geim, “Graphene: Status and prospects,” Science 324(5934):1530–1534, 2009.
Y. Lin et al., “Operation of graphene transistors at gigahertz frequencies,” Nano Lett. 9(1):422–426, 2009.
M.P. Levendorf, C.S. Ruiz-Vargas, S. Garg, and J. Park, “Transfer-free batch fabrication of single layer graphene transistors,” Nano Lett. 9(12):4479–4483, 2009.
Y. Cui, Z. Zhong, D. Wang, W. Wang, and C.M. Lieber, “High-performance silicon nanowire field-effect transistors,” Nano Lett. 3(2):149–152, 2003.
Toshiba Corporation, “Toshiba develops silicon nanowire transistor for 16-nm generation and beyond,” press release, June 15, 2010. http://www.physorg.com/news195834466.html
J.P. Colinge, C.W. Lee, A. Afzalian, N.D. Akhavan, R. Yan, I. Ferain, P. Razavi, B. O’Neill, A. Blake, M. White, A.M. Kelleher, B. McCarthy, and R. Murphy, “Nanowire transistors without junctions,” Nat. Nanotechnol. 5:225–229, 2010.
M.D. Austin et al., “Fabrication of 5-nm linewidth and 14-nm pitch features by nanoimprint lithography,” Appl. Phys. Lett. 84(26):5299–5301, 2004.
Y. Chen et al., “Nanoscale molecular-switch crossbar circuits,” Nanotechnology 14:462–468, 2003.
Y. Cui, L.J. Lauhon, M.S. Gudiksen, J. Wang, and C.M. Lieber, “Diameter-controlled synthesis of single crystal silicon nanowires,” Appl. Phys. Lett. 78(15):2214–2216, 2001.
D. Whang, S. Jin, Y. Wu, and C.M. Lieber, “Large-scale hierarchical organization of nanowire arrays for integrated nanosystems,” Nano lett. 3(9):1255–1259, 2003.
L.L. Chang, L. Esaki, and R. Tsu, “Resonant tunneling in semiconductor double barriers,” Appl. Phys. Lett. 24:593–595, 1974.
P. Mazumder, S. Kulkarni, M. Bhattacharya, and A. Gonzalez, “Circuit design using resonant tunneling diodes,” Proc. Int. Conf. VLSI Design: VLSI for Signal Processing, 1998.
M. Asada, S. Suzuki, and N. Kishimoto, “Resonant tunneling diodes for sub-terahertz and terahertz oscillators,” Jpn. J. Appl. Phys. 47(6):4375–4384, 2008.
J.P. Sun et al., “Resonant tunneling diodes: Models and properties,” Proc. IEEE 86(4):641–661, 1998.
S. Watanabe, M. Maeda, T. Sugisaki, and K. Tsutsui, “Fluoride resonant tunneling diodes on Si substrates improved by additional thermal oxidation process,” Jpn. J. Appl. Phys. 44(4B):2637–2641, 2005.
M. Wilson et al., Nanotechnology: Basic Science and Emerging Technologies, London: Chapman & Hall, 2002.
R. Zhang, K. Walus, W. Wang, and G.A. Jullien, “A method of majority logic reduction for quantum cellular automata,” IEEE Trans. Nanotechnol. 3(4):443–450, 2004.
A. Vetteth et al., “RAM design using quantum-dot cellular automata,” Proc. Nanotechnol. Conf. Tradeshow 2:160–163, 2003.
A. Vetteh et al., “Quantum dot cellular automata carry-look-ahead adder and barrel shifter,” Proc. IEEE Emerging Telecommun. Technol. Conf., pp. 1–5, 2002.
I. Amlani et al., “Digital logic gate using quantum-dot cellular automata,” Science 284(5412):289–291, 1999.
E.N. Ganesh, L. Kishore, and M. Rangachar, “Implementation of quantum cellular automata combinational and sequential circuits using majority logic reduction method,” Int. J. Nanotechnol. Appl. 2(1):89–106, 2008.
X.S. Hu, M. Crocker, M. Niemier, M. Yan, and G. Bernstein, “PLAs in quantum-dot cellular automata,” Proc. Emerging VLSI Technologies and Architectures Conf., 2006.
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Chen, D., Jha, N.K. (2011). Introduction to Nanotechnology. In: Jha, N., Chen, D. (eds) Nanoelectronic Circuit Design. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7609-3_1
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