Thinned Backside-Illuminated (BSI) Imagers
Backside-illuminated (BSI) imagers are becoming popular due to their enhanced light sensitivity. During their fabrication advanced Si wafer thinning is used in combination with backside surface passivation techniques. In this section both technology for thin (hybrid) backside-illuminated imagers as well as the trade-offs they present between quantum efficiency and crosstalk are discussed and illustrated, with the use of imec imager results.
KeywordsRecombination Boron Ductility Expense Trench
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