Structure Impaired Mechanical Stability of Ultra-thin Chips

Chapter

Abstract

Flexibility of ultra-thin chips is an important condition for applications in flexible electronics. Especially, mechanical reliability of ultra-thin chips is a key factor generally determining the final performance and reliability of a flexible electronics product. Structures and designs implemented on the chips are the elements that weaken the mechanical stability of the final product. In this chapter the excellent mechanical strength of 20-μm thin silicon chips produced by the ChipfilmTM technology is discussed. The influences of different parameters, such as the number of anchors per chip edge, the backside porous silicon and the topography formed by CMOS integration, on their mechanical reliability are investigated by means of uniaxial bending tests. The experimental results are statistically evaluated by the Weibull theory, in which the resulting failure stress data are used to obtain the fracture strength and estimate failure origins of the tested ultra-thin chips.

Keywords

Brittle Trench 

Notes

Acknowledgments

The authors would like to thank Astrid Kiss for her contributions to this work and also Lutz Diesing and Peter Ostrowski for their assistance in carrying out the mechanical experiments. The authors also thank the Landesstiftung Baden-Württemberg for the financial support (project ChipfilmTM).

References

  1. 1.
    Zimmermann M, Burghartz JN, Appel W, Remmers N, Burwick C, Würz R, Tobail O, Schubert M, Palfinger G, Werner J (2006) A seamless ultra-thin chip fabrication and assembly process. IEDM Tech Dig 2006:1010–1012Google Scholar
  2. 2.
    Burghartz JN, Appel W, Rempp HD, Zimmermann M (2009) A new fabrication and assembly process for ultrathin chips. IEEE Trans Electron Devices 56(2):321–327CrossRefGoogle Scholar
  3. 3.
    Burghartz JN, Harendt C, Hoang T, Kiss A, Zimmermann M (2008) Ultra-thin chip fabrication for next-generation silicon processes. In: Proceedings of the IEEE BCTM, Capri, Italy, pp 131–137Google Scholar
  4. 4.
    Landesberger C, Klink G, Schwinn G, Aschenbrenner R (2001) New dicing and thinning concept improves mechanical reliability of ultra-thin silicon. In: Proceedings of the International Symposium on Advanced Packaging Materials, Braselton, GA, pp 92–97Google Scholar
  5. 5.
    Global Assembly and Packaging Committee (2003) Test method for measurement of chip (die) strength by mean of 3-point-bending. SEMI Standard G86-0303, JapanGoogle Scholar
  6. 6.
    ASTM International (2008) Standard test method for flexural strength of advanced ceramics at ambient temperature. ASTM Standard C1161–02c, West Conshohocken, PAGoogle Scholar
  7. 7.
    ASTM International (2007) Standard practice for reporting uniaxial strength data and estimating Weibull distribution parameters for advanced ceramics. ASTM Standard C1239-07, West Conshohocken, PAGoogle Scholar
  8. 8.
    Schoenfelder S, Ebert M, Landesberger C, Bock K, Bagdahn J (2007) Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron Reliab 47:168–178CrossRefGoogle Scholar
  9. 9.
    Kiss AV (2009) Mechanische Eigenschaften von Duennschichtsilizium. Diploma thesis, University of Stuttgart, GermanyGoogle Scholar
  10. 10.
    Release 12.0 Documentation for ANSYS Contact technology guide. ANSYS Inc. www.ansys.com Last accessed on May 2010

Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.Institute für Mikroelektronik Stuttgart (IMS CHIPS)StuttgartGermany

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