Abstract
Systems-in-foil are an emerging new class of flexible electronic products in which complete systems are integrated in thin polymeric foils. First, a brief overview of the basic material choices and fabrication concepts will be given. Then, more detailed attention will be paid to the approaches of heterogeneous integration of thin chips. The different integration process flows and challenges and application fields will be described for three distinct areas: (1) ultra-thin chip packages with high density interconnects; (2) embedded circuitries for low cost flip-chip attachment to flexible substrates; and (3) embedded optical chips. It is important also to balance secondary material properties like thermal expansion, elastic moduli and adhesion strengths of different materials used to facilitate reliable operation of systems-in-foil under mechanical bending and at varied temperatures.
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References
Polymer Vision product announcement. www.readius.com
Stella project home page www.stella-project.de
van den Brand J, de Baets J, van Mol T et al (2008) Systems-in-foil: devices, fabrication processes and reliability issues. Microelectron Reliab 48(8–9):1123–1128
Fjelstad J (2007) Flexible circuit technology. BR Publishing, Seaside
Greener J, Ng KC, Vaeth KM et al (2007) Moisture permeability through multilayered barrier films as applied to flexible OLED display. J Appl Polym Sci 106(5):3534–3542
Govaerts J, Bosman E, Christiaens W, Vanfleteren J (2010) Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology. IEEE Trans Adv Packag 33(1):72–78
Niklaus F, Enoksson P, Kälvesten E, Stemme G (2001) Low-temperature full wafer adhesive bonding. J Micromech Microeng 11:100–107
Christiaens W, Torfs T, Huwel W, Van Hoof C and Vanfleteren J (2009) 3D integration of ultra-thin functional devices inside standard multilayer flex laminates. 2009 European microelectronics and packaging conference (EMPC 2009), vol 1 and 2, Rimini, 16–18 June, pp 671–675
van den Brand J, Kusters R, Barink M, Dietzel A (2010) Flexible embedded circuitry: a novel process for high density, cost effective electronics. Microelectron Eng 87(10):1861–1867. doi:10.1016/j.mee.2009.11.004, available online
Bosman E, Van Steenberge G, Van Hoe B et al (2010) Highly reliable flexible active optical links. IEEE Photonics Technol Lett 22(5):287–289
Bona GL, Offrein BJ, Bapst U, Berger C, Beyeler R, Budd R, Dangel R, Dellmann L, Horst F (2004) Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board. Proc SPIE 5453:134–141
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Dietzel, A., van den Brand, J., Vanfleteren, J., Christiaens, W., Bosman, E., De Baets, J. (2011). System-in-Foil Technology. In: Burghartz, J. (eds) Ultra-thin Chip Technology and Applications. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7276-7_13
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DOI: https://doi.org/10.1007/978-1-4419-7276-7_13
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