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Substrate Handling Techniques for Thin Wafer Processing

  • Christof Landesberger
  • Sabine Scherbaum
  • Karlheinz Bock
Chapter

Abstract

This chapter describes the necessity that carrier techniques be developed for thin wafer handling and processing. After an explanation on the main requirements for handle substrate techniques, we give an overview on the following temporary bonding techniques and mechanisms: thermoplastic adhesives, release layers, soluble glues, reversible tapes, mechanical debonding and electrostatic bonding. Finally, we conclude that the development of appropriate carrier techniques for ultra-thin wafers represents a key element of future thin wafer technology.

Keywords

Complementary Metal Oxide Semiconductor Bond Layer Wafer Thickness Carrier Substrate Wafer Edge 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  • Christof Landesberger
    • 1
  • Sabine Scherbaum
  • Karlheinz Bock
  1. 1.Fraunhofer Research Institution for Modular Solid State Technologies (EMFT)MunichGermany

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