Abstract
This chapter describes the necessity that carrier techniques be developed for thin wafer handling and processing. After an explanation on the main requirements for handle substrate techniques, we give an overview on the following temporary bonding techniques and mechanisms: thermoplastic adhesives, release layers, soluble glues, reversible tapes, mechanical debonding and electrostatic bonding. Finally, we conclude that the development of appropriate carrier techniques for ultra-thin wafers represents a key element of future thin wafer technology.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Combe S, Cullen J and O’Keefe M (2006) Reversible wafer bonding: challenges in ramping up 150 mm GaAs wafer production to meet growing demand. CS Mantech Technical Digest, Vancouver, 24–27 April, 2006, pp 193–196
Mould D and Moore J (April 2002) A new alternative for temporary wafer mounting. GaAs Mantech, Technical Digest, pp 109–112
Puligadda R, Pillalamarri S, Hong W, Brubaker C, Wimplinger M, Pargfrieder S (2007) High-performance temporary adhesives for wafer bonding applications. Mater Res Soc Symp Proc 970
Pargfrieder S, Burggraf J, Burgstaller D, Privett M, Jouve A, Henry D, Sillon N (March 2009) 3D integration with TSV: temporary bonding and debonding. Solid State Technol 52(3)
Webb R (February 2010) Temporary bonding enables new processes requiring ultra-thin wafers. Solid State Technol 53(2). www.3M.com/wss
Richter F (2009) Carrier technology for wafer thinning developed by thin materials AG. 10th international workshop ‘be-flexible’, organized by Fraunhofer IZM, Munich, Germany, 25 November 2009. www.thin-materials.com
US patent #7,027,283 B2; European patent EP-1 305 821 B1
Landesberger C, Wieland R, Klumpp A, Ramm P, Drost A, Schaber U, Bonfert D, Bock K (June 2009) Electrostatic wafer handling for thin wafer processing. European microelectronics and packaging conference & exhibition, Rimini
Landesberger C, Scherbaum S, Bock K (2007) Carrier techniques for thin wafer processing. Conference on compound semiconductors manufacturing technology, Austin, 14–17 May 2007
Raschke R (2009) New transferable electrostatic carriers for applications in vacuum up to 400°C. 10th International workshop ‘be-flexible, organised by Fraunhofer IZM, Munich, 25 November 2009
Stieglauer H, Nösser J, Miller A, Jonson G, Behammer D, Landesberger C, Spöhrle H-P, Bock K (2010) Mobile electrostatic carrier (MEC) evaluation for a GaAs wafer backside manufacturing process. Conference on compound semiconductors manufacturing technology, Oregon, 17–20 May 2010
Wieland R, Hacker E, Landesberger C, Ramm P, Bock K (2008) Thin substrate handling by electrostatic force. Conference smart systems integration, Barcelona
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2011 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Landesberger, C., Scherbaum, S., Bock, K. (2011). Substrate Handling Techniques for Thin Wafer Processing. In: Burghartz, J. (eds) Ultra-thin Chip Technology and Applications. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7276-7_12
Download citation
DOI: https://doi.org/10.1007/978-1-4419-7276-7_12
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4419-7275-0
Online ISBN: 978-1-4419-7276-7
eBook Packages: EngineeringEngineering (R0)