Abstract
Inductive coupled communication is a wireless communication technology for three-dimensionally (3D) stacked chips in a package. As discussed in a previous chapter, capacitive coupled communication (see Figure 4.1) utilizes a pair of metal electrodes which forms a capacitive-coupling channel–essentially a capacitor–as a vertical wireless data link between stacked chips. In inductive coupled communication, a pair of metal coils creates an inductive-coupling channel–essentially a transformer–between stacked chips. Both of these are pure digital circuit solutions compatible with a standard CMOS technology. The metal electrodes and/or the metal coils can be fabricated by using IC interconnections.
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Miura, N., Sakurai, T., Kuroda, T. (2010). Inductive Coupled Communications. In: Ho, R., Drost, R. (eds) Coupled Data Communication Techniques for High-Performance and Low-Power Computing. Integrated Circuits and Systems, vol 0. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6588-2_4
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DOI: https://doi.org/10.1007/978-1-4419-6588-2_4
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