Abstract
Capacitive coupled communication is a wireless chip to chip communication technology that uses capacitive coupling to transfer signals from a chip to neighboring chips. Its high-bandwidth, low-power, and low-latency chip-to-chip I/O capabilities enable the construction of high-performance and economical multi-chip modules (MCMs). Chips are placed face-to-face (Figure 1), with only a few microns of separation, such that overlapping transceiver circuits communicate through capacitive coupling between top-layer metal pads [1]. By using relatively small metal structures to communicate signals over short distances, capacitive coupled communication directly improves channel density, power, and latency to more closely match the performance of on-chip wires.
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Hopkins, D., Chow, A., Liu, F., Patil, D.D., Eberle, H. (2010). Capacitive Coupled Communication. In: Ho, R., Drost, R. (eds) Coupled Data Communication Techniques for High-Performance and Low-Power Computing. Integrated Circuits and Systems, vol 0. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6588-2_3
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DOI: https://doi.org/10.1007/978-1-4419-6588-2_3
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