Abstract
This chapter addresses a reliability issue of MEMS that is crucial for their commercialization, which is their survivability under mechanical shocks. Unlike conventional electronics of passive elements, MEMS contain flexible components that are deliberately designed to undergo some kind of motion. Thus, a natural question comes of how these microstructures respond when they are subjected to dynamic shock loads? What about short circuit and stiction when they make contacts with the substrate or stationary electrodes due to shock loads? These are some of the issues that are treated in this chapter. In addition, the impact of electrostatic forces on the dynamic response is illustrated. The interaction of the motion of microstructures with the printed circuit boards where they are mounted on is also discussed.
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References
Béliveau A, Spencer G T, Thomas K A, and Roberson S L (1999) Evaluation of MEMS capacitive accelerometers. Design & Test of Computers. 16: 48-56
Brown T G (2003) Harsh military environments and microelectromechanical (MEMS) devices. Proceeding of IEEE Sensors, 753-760
Brown T G and Davis B S (1998) Dynamic high-g loading of MEMS sensors: Ground and flight testing. Proceeding. SPIE - The Int. Society for Optical Engineering, Bellingham WA, 228-235
Brown T G, Davis B S, Hepner D, Faust J, Myers C, Muller C, Harkins T, Hollis M, Miller C, and Placzankis B (2001) Strap-down microelectromechanical (MEMS) sensors for high-G munition applications. IEEE Transactions on Magnetics. 37: 336-342
Tanner D M, Walraven J A, Helgesen K, Irwin L W, Smith N F, and Masters N (2000) MEMS reliability in shock environments. Proceeding IEEE International Reliability Physics Symposium, 129-138
Li G X, and Shemansky J R (2000) Drop test and analysis on micro-machined structures. Sensors Actuators A. 85: 280-286
Sheey M, Punch J, Goyal S, Reid M, Lishchynska M, and Kelly G (2009) The Failure mechanisms of micro-scale cantilevers in shock and vibration stimuli. Journal Strain. 45–3: 283-294
Kelly G, Punch J, Goyal S, and Sheehy M (2008) Analysis of shock pulses from a small velocity amplifier. Proceedings of the SEM XI International Congress & Exposition on Experimental and Applied Mechanics, Orlando, Florida
Kimberley J, Cooney R S, Lambros J, Chasiotis I, and Barker N S (2009) Failure of Au RF-MEMS switches subjected to dynamic loading Sensors and Actuators A. doi: 10.1016/j.sna.2009.06.004, (9 pages)
Cunningham S, McIntyre S, Carper J, Jaramillo J, and Tang W C (1996) Microstructures designed for shock robustness. Proceeding of SPIE - The Int. Society for Optical Engineering, 99-107
Wagner U, Franz J, Schweiker M, Bernhard W, Muller-Fiedler R, Michel B, and Paul B (2001) Mechanical reliability of MEMS-structures under shock load. Microelectronic Reliability. 41: 1657-1662
Lim B B, Yang J P, Chen S X, Mou J Q, and Lu Y (2002) Shock analysis of MEMS actuator integrated with HGA for operational and non-operational HDD. Digest of the Asia-Pacific Magnetic Recording Conference, WE-P-18-01-WE-P-18-02
Atwell A R, Okojie R S, Kornegay K T, Roberson S L, and Beliveau A (2003) Simulation, fabrication and testing of bulk micromachined 6H-SiC high-g piezoresistive accelerometers. Sensors Actuators A. 104: 11-18
Jiang Y, Du M, Huang W, Xu W, and Luo L (2003) Simulation on the encapsulation effect of the high-G shock MEMS accelerometer. Proceeding of the 5th Int. Conf. on Electronics Packaging Technology, Shanghai, pp: 52-55
Fan M S and Shaw H C (2001) Dynamic response assessment for the MEMS accelerometer under severe shock loads. National Aeronautics and Space Administration NASA, Washington, DC TP—2001–209978, Washington, DC
Mariani S, Ghisi A, Corigliano A, and Zerbini S (2007) Multi-scale analysis of MEMS sensors subject to drop impacts. Sensors. 7: 1817-1833
Mariani S, Ghisi A, Corigliano A, and Zerbini S (2009) Modeling impact-induced failure of polysilicon MEMS: a multi-scale approach. Sensors. 9: 556-567
Srikar V T and Senturia S D (2002) The reliability of microelectromechanical systems (MEMS) in shock environments. Journal of Micromechanics and Microengineering. 11: 206-214
Qian Z, Tomase J, Lian K (2004) Mechanical simulation for the robust design of RF-MEMS switches. Proceedings of the ASME Intl. Conf. of Mechanical Engineering Congress and Exposition (MEMS), Anaheim, CA, IMECE2004-60112
Coster J D, Tilmans H C, van Beek J T M, Rijks T G S M, and Puers R (2004) The influence of mechanical shock on the operation of electrostatically driven RF-MEMS switches. Journal of Micromechanics and Microengineering. 14: S49-S54
Bao M, Huang Y, Yang H, and Wang Y (2004) Reliable operation conditions of capacitive inertial sensor for step and shock signals. Sensors and Actuators A. 114: 41-48
Khatami F and Rezazadeh G (2008) Dynamic response of a torsional micromirror to electrostatic force and mechanical shock. Microsystem Technology. 15: 535-545
Ghisi A, Kalicinski S, Mariani S, De Wolf I, and Corigliano A (2009) Polysilicon MEMS accelerometers exposed to shocks: numerical-experimental investigation. Journal of Micromechanics and Microengineering. 19: 035023
Tas N, Sonnenberg T, Jansen H, Legtenberg R, and Elwenspoek M (1996) Stiction in surface micromachining. Journal of Micromechanics and Microengineering. 6:385-397
Fang X W, Huang Q A, and Tang J Y (2004) Modeling of MEMS reliability in shock environments. Proceeding of 7th Int. Conf. on Solid-State and Integrated Circuits Technology, Beijing, 860 - 863
Yee J K, Yang H H, Judy J W (2003) Shock resistance of ferromagnetic micromechanical magnetometers. Sensors Actuators A. 103: 242-52
Millet O, Collard D, and Buchaillot L (2002) Reliability of packaged MEMS in shock environments: crack and stiction modeling. Design, Test, Integration and Packaging of MEMS/MOEMS, Cannes, 696 - 703
Younis M I, Miles R, and Jordy D (2006) Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces. Journal of Micromechanics and Microengineering. 16: 2463-2474
Younis M I, Alsaleem F, and Jordy D (2007) The Response of clamped-clamped microbeams under mechanical shock. International Journal of Nonlinear Mechanics. 42: 643-657
Younis M I, Alsaleem F M, Miles R., and Su Q (2007) Characterization for the performance of capacitive switches activated by mechanical shock. Journal of Micromechanics and Microengineering. 17: 1360-1370
Alsaleem F M, Younis M I, and Ibrahim M (2009) A study for the effect of the PCB motion and electrostatic force on the dynamics of MEMS devices under mechanical shock. Journal of Micromechanics and Microengineering. 18-3: 597-609
Ibrahim M and Younis M I (2010) The dynamic response of electrostatically driven resonators under mechanical shock. Journal of Micromechanics and Microengineering. 20: doi: 025006
Ibrahim M, Younis M I, and Alsaleem F M (2010) An Investigation into the Effects of Electrostatic and Squeeze-Film Nonlinearities on the Shock Spectrum of Microstructures. International Journal of Nonlinear Mechanics. 45-8: doi:10.1016/j.ijnonlinmec.2010.05.005
Ouakad H, Alsaleem F A, Younis M I, Levo T, and Pitarresi J (2010) Response of an electrostatically actuated microbeam to drop-table test. IEEE Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Microsystems Conference, Eurosim 2010, Bordeaux, France, April,doi: 0.1109/ESIME.2010.5464602
Younis M I, Jordy D, and Pitarresi J (2007) Computationally efficient approaches to characterize the dynamic response of microstructures under mechanical shock. Journal of Microelectromechanical Systems. 16: 628-638
Alsaleem M, Younis M I, and Miles R (2008) An investigation into the effect of the PCB motion on the dynamic response of MEMS devices under mechanical shock loads. Journal of Electronic Packaging, 130: 31002–31011, doi: 10.1115/1.2957319
Ramini A H, Younis M I, Miles R, and Pitarresi J (2010) Modeling the effects of PCB motion on the response of microstructures under mechanical shock. IEEE Thermal, Mechanical & Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Microsystems Conference, Eurosim 2010, Bordeaux, France, doi: 10.1109/ESIME.2010.5464602
Jordy D and Younis M I (2008) Characterization of the dynamical response of a micromachined G-sensor to mechanical shock loading under the influence of squeeze-film damping. Journal of Dynamic Systems, Measurement, and Control. 130: doi: 10.1115/1.2936849
Yagubizade H, Younis M I, Rezazadeh G (2009) The effect of squeeze-film damping on suppressing the shock response of MEMS. Proceedings of IMECE2009 2009 ASME International Mechanical Engineering Congress and Exposition, Lake Buena Vista, Florida, USA, paper #IMECE2009- 12433
Meirovitch L (2001) Fundamentals of Vibrations. McGraw-Hill, New York
Steinberg D S (2000) Vibration Analysis for Electronic Equipment, 3rd edition. Wiley, New York
Shigley J, Mischke J, Budynas R (2004) Mechanical Engineering Design. McGraw-Hill, New York
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Younis, M.I. (2011). Mechanical Shock in MEMS. In: MEMS Linear and Nonlinear Statics and Dynamics. Microsystems, vol 20. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6020-7_8
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DOI: https://doi.org/10.1007/978-1-4419-6020-7_8
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