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Root Cause and Failure Analysis

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Book cover MEMS Reliability

Part of the book series: MEMS Reference Shelf ((MEMSRS))

Abstract

This chapter will cover strategies for identifying root cause and corrective action of reliability field failures. The MEMS reliability program must include strategies for identifying potential failure modes, failure mechanisms, risk areas in design and process, and containment strategies. Containment of the failure is crucial to achieving a low field failure rate while the root cause is determined and the proper corrective action is developed, checked for effectiveness, and then finally implemented into production.

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Author information

Authors and Affiliations

  1. Lilliputian Systems, Inc., 36 Jonspin Road, Wilmington, MA, 01887-1091, USA

    Allyson L. Hartzell

  2. RSTC, MS-112, Analog Devices Inc., 804 Woburn Street, Wilmington, MA, 01887, USA

    Mark G. da Silva

  3. Microsystems for Space Technologies Laboratory, EPFL, Rue Jaquet-Droz 1, CH-2002, Neuchatel, Switzerland

    Herbert R. Shea

Authors
  1. Allyson L. Hartzell
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  2. Mark G. da Silva
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  3. Herbert R. Shea
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Corresponding author

Correspondence to Allyson L. Hartzell .

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© 2011 Springer Science+Business Media, LLC

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Hartzell, A.L., da Silva, M.G., Shea, H.R. (2011). Root Cause and Failure Analysis. In: MEMS Reliability. MEMS Reference Shelf. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6018-4_5

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  • DOI: https://doi.org/10.1007/978-1-4419-6018-4_5

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-6017-7

  • Online ISBN: 978-1-4419-6018-4

  • eBook Packages: EngineeringEngineering (R0)

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