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In-Use Failures

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MEMS Reliability

Part of the book series: MEMS Reference Shelf ((MEMSRS))

Abstract

This chapter addresses in-use failures of MEMS, with an emphasis on the physics of failure. Chapter 3 dealt with eliminating failures from a design and manufacturing perspective. In this chapter we focus on how a well-designed, fabricated and packaged device can fail in use. There is a tight link between the design, manufacturing and in-use failures. Understanding the physics of failure (e.g., creep, fatigue) and the properties of materials used and the link to the process flow (e.g., yield strength of poly-silicon following HF release) lead to improved design rules to ensure the device will operate reliably in the expected operating environment. A concurrent design of the package is often required, but is not addressed in this chapter.

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Notes

  1. 1.

    This procedure was developed by Subramanian Sundaram at the EPFL.

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Authors and Affiliations

  1. Lilliputian Systems, Inc., 36 Jonspin Road, Wilmington, MA, 01887-1091, USA

    Allyson L. Hartzell

  2. RSTC, MS-112, Analog Devices Inc., 804 Woburn Street, Wilmington, MA, 01887, USA

    Mark G. da Silva

  3. Microsystems for Space Technologies Laboratory, EPFL, Rue Jaquet-Droz 1, CH-2002, Neuchatel, Switzerland

    Herbert R. Shea

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  1. Allyson L. Hartzell
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  3. Herbert R. Shea
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Hartzell, A.L., da Silva, M.G., Shea, H.R. (2011). In-Use Failures. In: MEMS Reliability. MEMS Reference Shelf. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-6018-4_4

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