Skip to main content
SpringerLink
Log in
SpringerLink
Log in

Flip Chip Underfill: Materials, Process, and Reliability

  • Chapter
  • First Online:
Advanced Flip Chip Packaging

Abstract

In order to enhance the reliability of a flip chip on organic board package, underfill is usually used to redistribute the thermomechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill resin and has many disadvantages. In order to overcome these disadvantages, many variations have been invented to improve the flip chip underfill process. This paper reviews the recent advances in the material design, process development, and reliability issues of flip chip underfill, especially in no-flow underfill, molded underfill, and wafer-level underfill. The relationship between the materials, process, and reliability in these packages is discussed.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 139.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 179.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Wong CP, Lou S, Zhang Z (2000) Flip the chip. Science 290:2269

    Article  Google Scholar 

  2. Davis E, Harding W, Schwartz R, Coring J (1964) Solid logic technology: versatile high performance microelectronics. IBM J Res Dev 8:102

    Article  Google Scholar 

  3. Nakano F, Soga T, Amagi S (1987) Resin-insertion effect on thermal cycle resistivity of flip-chip mounted LSI devices. In: The proceedings of the international society of hybrid microelectronics conference, p 536

    Google Scholar 

  4. Tsukada Y (1992) Surface laminar circuit and flip-chip attach packaging. In: Proceedings of the 42nd electronic components and technology conference, p 22

    Google Scholar 

  5. Han B, Guo Y (1995) Thermal deformation analysis of various electronic packaging products by Moire and microscope Moire interferometry. J Electronic Packaging 117:185

    Article  Google Scholar 

  6. Han S, Wang KK (1997) Analysis of the flow of encapsulant during underfill encapsulation of flip-chips. IEEE Trans Compon Packaging Manuf Technol Part B 20(4):424–433

    Article  MathSciNet  Google Scholar 

  7. Han S, Wang KK, Cho SY (1996) Experimental and analytical study on the flow of encapsulant during underfill encapsulation of flip-chips. In: Proceedings of the 46th electronic components and technology conference, pp 327–334

    Google Scholar 

  8. Nguyen L, Quentin C, Fine P, Cobb B, Bayyuk S, Yang H, Bidstrup-Allen SA (1999) Underfill of flip-chip on laminates: simulation and validation. IEEE Trans Compon Packaging Manuf Technol 22(2):168–176

    Article  Google Scholar 

  9. Young WB, Yang WL (2006) Underfill of flip-chip: the effect of contact angle and solder bump arrangement. IEEE Trans Adv Packaging 29(3):647–653

    Article  Google Scholar 

  10. Rodriguez F (1996) Principles of polymer systems, Chapter 3: physical states and transitions. Taylor & Francis, Washington, DC

    Google Scholar 

  11. Ward IM, Hadley DW (1993) An introduction to the mechanical properties of solid polymers, Chapter 4: principles of linear viscoelasticity. John Wiley & Sons Ltd, New York

    Google Scholar 

  12. Tobolsky AV (1960) Properties and structure of polymers. Wiley, New York

    Google Scholar 

  13. Bressers H, Beris P, Caers J, Wondergerm J (1996) Influence of chemistry and processing of flip-chip underfills on reliability. In: 2nd international conference on adhesive joining and coating technology in electronics manufacturing, Stockholm Sweden

    Google Scholar 

  14. Nysaether JB, Lundstrom P, Liu J (1998) Measurements of solder bump lifetime as a function of underfill material properties. IEEE Trans Compon Packaging Manuf Technol Part A 21(2):281–287

    Article  Google Scholar 

  15. Dudek R, Schubert A, Michel B (2000) Analyses of flip-chip attach reliability. In: Proceedings of 4th international conference on adhesive joining and coating technology in electronics manufacturing, pp 77–85

    Google Scholar 

  16. Palaniappan P, Selman P, Baldwin D, Wu J, Wong CP (1998) Correlation of flip-chip underfill process parameters and material properties with in-process stress generation. In: Proceedings of the 48th electronic components and technology conference, pp 838–847

    Google Scholar 

  17. Mercado L, Sarihan V (2003) Evaluation of die edge cracking in flip-chip PBGA packages. IEEE Trans Compon Packaging Technol 26 (4):719–723

    Article  Google Scholar 

  18. van Vroonhoven JCW (1993) ASME Trans J Electronic Packaging 115:28–32

    Article  Google Scholar 

  19. Luo S, Wong CP (2001) IEEE Trans Compon Packaging Technol 24:38–42

    Article  Google Scholar 

  20. Lam DCC, Yang F, Tong P (1999) IEEE Trans Compon Packaging Technol 22:215–220

    Article  Google Scholar 

  21. Wong EH, Chan KC, Rajoo R, Lim TB (2000) In: Proceedings of the 50th electronic components and technology conference, pp 576–580

    Google Scholar 

  22. Luo S, Wong CP (2004) J Adhes Sci Technol 18(2):275

    Article  Google Scholar 

  23. Luo S, Leisen J, Wong CP (2001) In: Proceedings of the 51st electronic components and technology conference, pp 149

    Google Scholar 

  24. Andrews EH (1991). In: Lee LH (ed) Adhesive bonding, Plenum Press, New York

    Google Scholar 

  25. Mittal KL (ed) (1992) Silanes and other coupling agents. VSP, Utrecht

    Google Scholar 

  26. Mittal KL (ed) (2000) Silanes and other coupling agents, vol 2. VSP, Utrecht

    Google Scholar 

  27. Welsh DJ, Pearson RA, Luo S, Wong CP (2001) In: Proceedings of the 51st electronic components and technology conference, pp 1502

    Google Scholar 

  28. Chen T, Wang J, Lu D (2004) Emerging challenges of underfill for flip-chip application. In: Proceedings of the 54th electronic components and technology conference, pp 175–179

    Google Scholar 

  29. Hwang JS (2000) Lead-free solder: the Sn/Ag/Cu system. Surface Mount Technology, p 18

    Google Scholar 

  30. Huang B, Lee NC (1999) Prospect of lead free alternatives for reflow soldering. In: Proceedings of SPIE—the international society for optical engineering, vol 3906, p 771

    Google Scholar 

  31. Butterfield A, Visintainer V, Goudarzi V (2000) Lead-free solder paste flux evaluation and implementation in personal communication devices. In: Proceedings of the 50th electronic components and technology conference, p 1420

    Google Scholar 

  32. Mahalingam S, Goray K, Joshi A (2004) Design of underfill materials for lead free flip-chip application. In: Proceedings of 2004 I.E. international society conference on thermal phenomena, pp 473–479

    Google Scholar 

  33. Chee CK, Chin YT, Sterrett T, He Y, Sow HP, Manepali R, Chandran D (2002) Lead-free compatible underfill materials for flip-chip application. In: Proceedings of the 52nd electronic components and technology conference, pp 417–424

    Google Scholar 

  34. Tsao P, Huang C, Li M, Su B, Tsai N (2004) Underfill characterization for low-K dielectric/Cu interconnect IC flip-chip package reliability. In: Proceedings of the 54th IEEE electronic components and technology conference, pp 767–769

    Google Scholar 

  35. Rajagopalan S, Desai k, Todd M, Carson G (2004) Underfill for low-K silicon technology. In: Proceedings of 2004 IEEE/SEMI international electronics manufacturing technology symposium

    Google Scholar 

  36. Pennisi R, Papageorge M (1992) Adhesive and encapsulant material with fluxing properties. US Patent 5,128,746, 7 July 1992

    Google Scholar 

  37. Wong CP, Baldwin D (1996) No-flow underfill for flip-chip packages. US Patent Disclosure, April 1996

    Google Scholar 

  38. Wong CP, Shi SH (2001) No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant. US Patent 6,180,696, 30 Jan 2001

    Google Scholar 

  39. Wong CP, Shi SH, Jefferson G (1997) High performance no flow underfills for low-cost flip-chip applications. In: Proceedings of the 47th electronic components and technology conference, pp 850

    Google Scholar 

  40. Wong CP, Shi SH, Jefferson G (1998) High performance no-flow underfills for flip-chip applications: material characterization. IEEE Trans Compon Packaging Manuf Technol Part A 21(3):450

    Article  Google Scholar 

  41. Zhang Z, Shi SH, Wong CP (2000) Development of no-flow underfill materials for lead-free bumped flip-chip applications. IEEE Trans Compon Packaging Manuf Technol 24(1):59–66

    Article  Google Scholar 

  42. Zhang Z, Wong CP (2000) Development of no-flow underfill for lead-free bumped flip-chip assemblies. In: Proceedings of electronics packaging technology conference, Singapore, pp 234–240

    Google Scholar 

  43. Zhang Z, Wong CP (2002) Study and modeling of the curing behavior of no-flow underfill. In: Proceedings of the 8th international symposium and exhibition on advanced packaging materials processes, properties and interfaces, Stone Mountain, Georgia, pp 194–200

    Google Scholar 

  44. Morganelli P, Wheelock B (2001) Viscosity of a no-flow underfill during reflow and its relationship to solder wetting. In: Proceedings of the 51st electronic components and technology conference, pp 163–166

    Google Scholar 

  45. Johnson RW, Capote MA, Chu S, Zhou L, Gao B (1998) Reflow-curable polymer fluxes for flip-chip encapsulation. In: Proceedings of international conference on multichip modules and high density packaging, pp 41–46

    Google Scholar 

  46. Shi SH, Wong CP (1998) Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications. In: Proceedings of the 48th electronic components and technology conference, pp 117

    Google Scholar 

  47. Shi SH, Lu D, Wong CP (1999) Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability. In: Proceedings of the 5th international symposium on advanced packaging materials: processes, properties and interfaces, pp 325

    Google Scholar 

  48. Shi SH, Wong CP (1999) Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications. IEEE Trans Compon Packaging Technol Part A 22(2):141

    Article  Google Scholar 

  49. Palm P, Puhakka K, Maattanen J, Heimonen T, Tuominen A (2000) Applicability of no-flow fluxing encapsulants and flip-chip technology in volume production. In: Proceedings of the 4th international conference on adhesive joining and coating technology in electronics manufacturing, pp 163–167

    Google Scholar 

  50. Puhakka K, Kivilahti JK (1998) High density flip-chip interconnections produced with in-situ underfills and compatible solder coatings. In: Proceedings of the 3rd international conference on adhesives joining and coating technology in electronics manufacturing, pp 96–100

    Google Scholar 

  51. Wang T, Chew TH, Chew YX, Louis Foo (2001) Reliability studies of flip-chip package with reflowable underfill. In: Proceedings of the pan pacific microelectronic symposium, Kauai, Hawaii, 2001, pp 65–70

    Google Scholar 

  52. Zhang Z, Wong CP (2002) Assembly of lead-free bumped flip-chip with no-flow underfills. IEEE Trans Compon Packaging Manuf Technol 25(2):113–119

    Google Scholar 

  53. Miller D, Baldwin DF (2001) Effects of substrate design on underfill voiding using the low cost, high throughput flip-chip assembly process. Proceedings of the 7th international symposium on advanced packaging materials: processes, properties and interfaces, pp 51–56

    Google Scholar 

  54. Zhao R, Johnson RW, Jones G, Yaeger E, Konarski M, Krug P, Crane L (2002) Processing of fluxing underfills for flip-chip-on-laminate assembly. In: Presented at IPC SMEMA Council APEX 2002, Proceeding of APEX, San Diego, CA, pp S18-1-1–S18-1-7

    Google Scholar 

  55. Wang T, Lum C, Kee J, Chew TH, Miao P, Foo L, Lin C (2000) Studies on a reflowable underfill for flip-chip application. In: Proceedings of the 50th electronic components and technology conference, pp 323–329

    Google Scholar 

  56. Gamota D, Melton CM (1997) The development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly. IEEE Trans Compon Packaging Manuf Technol Part C 20(3):183

    Article  Google Scholar 

  57. Dai X, Brillhart MV, Roesch M, Ho PS (2000) Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging. IEEE Trans Compon Packaging Technol 23(1):117–127

    Article  Google Scholar 

  58. Smith BS, Thorpe R, Baldwin DF (2000) A reliability and failure mode analysis of no flow underfill materials for low cost flip-chip assembly. In: Proceedings of 50th electronic components and technology conference, pp 1719–1730

    Google Scholar 

  59. Moon KS, Fan L, Wong CP (2001) Study on the effect of toughening of no-flow underfill on fillet cracking. In: Proceedings of the 51st electronic components and technology conference, pp 167–173

    Google Scholar 

  60. Wang H, Tomaso T (2000) Novel single pass reflow encapsulant for flip-chip application. In: Proceedings of the 6th international symposium on advanced packaging materials: process, properties, and interfaces, pp 97–101

    Google Scholar 

  61. Zhang Z, Fan L, Wong CP (2002) Development of environmental friendly non-anhydride no-flow underfills. IEEE Trans Compon Packaging Technol 25(1):140–147

    Article  Google Scholar 

  62. Shi SH, Yao Q, Qu J, Wong CP (2000) Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials. In: Proceedings of the 6th international symposium on advanced packaging materials: processes, properties and interfaces, pp 271–277

    Google Scholar 

  63. Shi SH, Wong CP (1999) Recent advances in the development of no-flow underfill encapsulants—a practical approach towards the actual manufacturing application. In: Proceedings of the 49th electronic components and technology conference, p 770

    Google Scholar 

  64. Miao P, Chew Y, Wang T, Foo L (2001) Flip-chip assembly development via modified reflowable underfill process. In: Proceedings of the 51st electronic components and technology conference, pp 174–180

    Google Scholar 

  65. Kawamoto S, Suzuki O, Abe Y (2006) The effect of filler on the solder connection for no-flow underfill. In: Proceedings of the 56th electronic components and technology conference, pp 479–484

    Google Scholar 

  66. Zhang Z, Lu J, Wong CP (2001) Provisional Patent 60/288,246: “a novel process approach to incorporate silica filler into no-flow underfill”

    Google Scholar 

  67. Zhang Z, Lu J, Wong CP (2001) A novel approach for incorporating silica fillers into no-flow underfill. In: Proceedings of the 51st electronic components and technology conference, pp 310–316

    Google Scholar 

  68. Zhang Z, Wong CP (2002) Novel filled no-flow underfill materials and process. In: Proceedings of the 8th international symposium and exhibition on advanced packaging materials processes, properties and interfaces, pp 201–209

    Google Scholar 

  69. Gross KM, Hackett S, Larkey DG, Scheultz MJ, Thompson W (2002) New materials for high performance no-flow underfill. In: Symposium proceedings of IMAPS 2002, Denvor

    Google Scholar 

  70. Gross K, Hackett S, Schultz W, Thompson W, Zhang Z, Fan L, Wong CP (2003) Nanocomposite underfills for flip-chip application. In: Proceedings of the 53rd electronic components and technology conference, pp 951–956

    Google Scholar 

  71. Sun Y, Zhang Z, Wong CP (2004) Fundamental research on surface modification of nano-size silica for underfill applications. In: Proceedings of the 54th electronic components and technology conference, pp 754–760

    Google Scholar 

  72. Weber PO (2000) Chip package with molded underfill. US Patent 6,038,136, 14 Mar 2000

    Google Scholar 

  73. Weber PO (2000) Chip package with transfer mold underfill. US Patent 6, 157,086, 5 Dec 2000

    Google Scholar 

  74. Gilleo K, Cotterman B, Chen T (2000) Molded underfill for flip-chip in package. High density interconnection, p 28

    Google Scholar 

  75. Braun T, Becker KF, Koch M, Bader V, Aschenbrenner R, Reichl H (2002) Flip-chip molding—recent progress in flip-chip encapsulation. In: Proceedings of 8th international advanced packaging materials symposium, pp 151–159

    Google Scholar 

  76. Liu F, Wang YP, Chai K, Her TD (2001) Characterization of molded underfill material for flip-chip ball grid array packages. In: Proceedings of the 51st electronic components and technology conference, pp 288–292

    Google Scholar 

  77. Rector LP, Gong S, Miles TR, Gaffney K (2000) Transfer molding encapsulation of flip-chip array packages. In: IMAPS proceedings, pp 760–766

    Google Scholar 

  78. Han S, Wang KK (1999) Study on the pressurized underfill encapsulation of flip-chips. IEEE Trans Compon Packaging Manuf Technol Part B 20(4):434–442

    Google Scholar 

  79. Rector LP, Gong S, Gaffney K (2001) On the performance of epoxy molding compounds for flip-chip transfer molding encapsulation. In: Proceedings of the 51st electronic components and technology conference, pp 293–297

    Google Scholar 

  80. Becker KF, Braun T, Koch M, Ansorge F, Aschenbrenner R, Reichl H (2001) Advanced flip-chip encapsulation: transfer molding process for simultaneous underfilling and postencapsulation. In: Proceedings of the 1st international IEEE conference on polymers and adhesives in microelectronics and photonics, pp 130–139

    Google Scholar 

  81. Shi SH, Yamashita T, Wong CP (1999) Development of the wafer-level compressive-flow underfill process and its required materials. In: Proceedings of the 49th electronic components and technology conference, p 961

    Google Scholar 

  82. Shi SH, Yamashita T, Wong CP (1999) Development of the wafer-level compressive-flow underfill encapsulant. In: Proceedings of the 5th international symposium on advanced packaging materials: processes, properties and interfaces, p 337

    Google Scholar 

  83. Gilleo K, Blumel D (1999) Transforming flip-chip into CSP with reworkable wafer-level underfill. In: Proceedings of the Pan Pacific Microelectronics Symposium, p 159

    Google Scholar 

  84. Gilleo K (1999) Flip-chip with integrated flux, mask and underfill. WO Patent 99/56312, 4 Nov 1999

    Google Scholar 

  85. Qi J, Kulkarni P, Yala N, Danvir J, Chason M, Johnson RW, Zhao R, Crane L, Konarski M, Yaeger E, Torres A, Tishkoff R, Krug P (2002) Assembly of flip-chips utilizing wafer applied underfill. In: Presented at IPC SMEMA Council APEX 2002, Proceedings of APEX, San Diego, CA, pp S18-3-1–S18-3-7

    Google Scholar 

  86. Tong Q, Ma B, Zhang E, Savoca A, Nguyen L, Quentin C, Lou S, Li H, Fan L, Wong CP (2000) Recent advances on a wafer-level flip-chip packaging process. In: Proceedings of the 50th electronic components and technology conference, pp 101–106

    Google Scholar 

  87. Charles S, Kropp M, Kinney R, Hackett S, Zenner R, Li FB, Mader R, Hogerton P, Chaudhuri A, Stepniak F, Walsh M (2001) Pre-applied underfill adhesives for flip-chip attachment. In: IMAPS proceedings, international symposium on microelectronics, Baltimore, MD, pp 178–183

    Google Scholar 

  88. Zhang Z, Sun Y, Fan L, Wong CP (2004) Study on B-stage properties of wafer level underfill. J Adhes Sci Technol 18(3):361–380

    Article  Google Scholar 

  89. Zhang Z, Sun Y, Fan L, Doraiswami R, Wong CP (2003) Development of wafer level underfill material and process. In: Proceedings of 5th electronic packaging technology conference, Singapore, pp 194–198

    Google Scholar 

  90. Zenner RLD, Carpenter BS (2002) Wafer-applied underfill film laminating. In: Proceedings of the 8th international symposium on advanced packaging materials, pp 317–325

    Google Scholar 

  91. BurressRV, Capote MA, Lee Y-J, Lenos HA, Zamora JF (2001) A practical, flip-chip multi-layer pre-encapsulation technology for wafer-scale underfill. In: Proceedings of the 51st electronic components and technology conference, pp 777–781

    Google Scholar 

  92. Sun Y, Zhang Z, Wong CP (2005) Photo-definable nanocomposite for wafer level packaging. In: Proceedings of the 55th electronic components and technology conference, p 179

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Hewlett-Packard Company, 1000 NE Circle Blvd, Corvallis, OR, 97330, USA

    Zhuqing Zhang

  2. Micron Technology, Inc., 8000 S. Federal Way, 6, Boise, ID, 83707, USA

    Shijian Luo

  3. The Chinese University of Hong Kong, Shatin, NT, Hong Kong, SAR

    C. P. Wong (Dean of Engineering)

  4. Georgia Institute of Technology School of Materials Science & Engineering, 771 Ferst Drive, Atlanta, GA, 30332-0245, USA

    C. P. Wong (Dean of Engineering)

Authors
  1. Zhuqing Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Shijian Luo
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. C. P. Wong
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Zhuqing Zhang .

Editor information

Editors and Affiliations

  1. ASE Group, Chin 3rd Rd. 26, Kaohsiung, 81170, Taiwan R.O.C.

    Ho-Ming Tong

  2. ASE Group, Chin 3rd Rd. 26, Kaohsiung, 81170, Taiwan R.O.C.

    Yi-Shao Lai

  3. , Department of Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong, SAR, NT, China, People's Republic

    C.P. Wong

Rights and permissions

Reprints and permissions

Copyright information

© 2013 Springer Science+Business Media New York

About this chapter

Cite this chapter

Zhang, Z., Luo, S., Wong, C.P. (2013). Flip Chip Underfill: Materials, Process, and Reliability. In: Tong, HM., Lai, YS., Wong, C. (eds) Advanced Flip Chip Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5768-9_5

Download citation

  • DOI: https://doi.org/10.1007/978-1-4419-5768-9_5

  • Published:

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5767-2

  • Online ISBN: 978-1-4419-5768-9

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation