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Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages

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Book cover Moisture Sensitivity of Plastic Packages of IC Devices

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Abstract

A comprehensive and integrated approach is established to simulate the package reliability of IC packages with detailed considerations of effects of moisture diffusion, heat transfer, thermo-mechanical stress, hygro-mechanical stress, and vapor pressure under combined temperature/humidity conditions. QFN (quad flat non-lead) and FCBGA (flip chip ball grid array) packages are used as test vehicles. The critical plastic materials, i.e., mold compound, die attach, underfill, solder resist, and plastic substrate, are characterized for hygroswelling and moisture properties. Due to CME (coefficient of moisture expansion) mismatch among various materials, hygro-mechanical stress is induced. The concept is analogous to CTE (coefficient of thermal expansion) mismatch which results in thermo-mechanical stress. The vapor pressure can be calculated based on local moisture concentration, according to a well-accepted multi-scale vapor pressure model developed by Fan et al. [Proceedings of 1st EMAP Conference, Singapore, 1999, 38–45, ASME Journal of Electronic Packaging, 127(3):262–267, 2005, ASME Journal of Electronic Packaging, 131(3):031010, 2009, IEEE Transactions on Components and Packaging Technologies, 31(2):252–259, 2008]. Results show that the vapor pressure saturates much faster than the moisture diffusion and a near uniform vapor pressure is reached in the package. The vapor pressure introduces additional strain of the same order as the thermal strain and hygro-strain to the package. Subsequently, the interfacial fracture mechanics model is applied to study the effect of crack length on die/mold compound and die/die attach delamination. This chapter also presents results of the combined thermo-mechanical and hygro-mechanical modeling to study the failures during pressure cooker test (PCT), and a very good agreement with experimental data is obtained.

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References

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Authors and Affiliations

  1. Blk 408, Hougang Ave 10, #07-1082, Singapore, Singapore, 530408

    T.Y. Tee

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Correspondence to T.Y. Tee .

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Editors and Affiliations

  1. Dept. Mechanical Engineering, Lamar University, Beaumont, 77710, USA

    X.J. Fan

  2. ERS Co., Alvina Court 727, Los Altos, 94024, USA

    E. Suhir

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Tee, T. (2010). Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages. In: Fan, X., Suhir, E. (eds) Moisture Sensitivity of Plastic Packages of IC Devices. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5719-1_9

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  • DOI: https://doi.org/10.1007/978-1-4419-5719-1_9

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