Skip to main content
SpringerLink
Log in

Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques

  • Chapter
  • First Online:
Moisture Sensitivity of Plastic Packages of IC Devices

  • 2381 Accesses

Abstract

The reliability issues have been converted to the underfill adjacent interfaces since the introduction of the underfill to flip chip package in the 1990s. Both thermal cycling and hygrothermal conditioning severely attack the interfaces to delaminate. The moisture migrating into the underfill decreases the adhesion strength, swells to deform the assembly, and weakens the mechanical and thermal properties of the material. In this chapter, interfacial reliability of a sandwiched assembly exposed at 85°C/85%RH was studied using photomechanics measurement techniques, i.e., moiré interferometry (MI) and digital image correlation (DIC). A thermal aging study was simultaneously performed to understand the long-term reliability of the assembly. The results showed that the thermal aging relieved the stresses induced by hygrothermal swelling mismatch between dissimilar materials involved, whereas it increased the strains induced by hygrothermal swelling. It indicated that the time effect is not negligible when the assembly is subjected to moisture conditioning; otherwise, the deformation induced by the swelling could be overestimated. The DIC technique was applied to measure the critical interfacial fracture toughness of the interface. The results showed that the moisture could significantly reduce the interfacial strength due to the break of hydrogen bonding. By combining the MI and DIC results, it was concluded that the hygrothermal loading could increase the possibility of interfacial delamination in a flip chip package. Finally, the morphologies of the fractured surface were studied with the aid of scanning electron microscope (SEM). Remarkable changes of the failure mode were observed.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 219.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 279.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 279.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Fan, X.J., Wang, H.B., Lim, T.B., “Investigation of the underfill delamination and cracking for flip chip module during thermal cyclic loading” IEEE Transactions of Components and Packaging Technologies, 24(1), 84–91.

    Google Scholar 

  2. Zhang, G.Q., van Driel, W.D., Fan, X.J., Mechanics of Microelectronics. New York, NY: Springer, 2006.

    Book  MATH  Google Scholar 

  3. Fan, X.J., Zhou, J., Zhang, G.Q., L.J. Ernst, “A micromechanics based vapor pressure model in electronic packages”, ASME Journal of Electronic Packaging, 127(3), 262–267, 2005.

    Article  Google Scholar 

  4. Ferguson, T., Qu, J.M., “Effect of moisture on the interfacial adhesion of the underfill/solder mask interface,” Journal of Electronic Packaging, 124, 106–110, 2002.

    Article  Google Scholar 

  5. Okura, J.H., Dasgupta, A., Caers, J.F.J.M., “Hygro-mechanical durability of underfilled flip-chip-on-board (FCOB) interconnects,” Journal of Electronic Packaging, 124, 184–187, 2002.

    Article  Google Scholar 

  6. Fan, X.J., Zhang, G.Q., Ernst, L.J., “Interfacial delamination mechanisms during reflow with moisture preconditioning”, IEEE Transactions of Components and Packaging Technologies, 31(2), 252–259, 2008.

    Google Scholar 

  7. Xie, B., Shi, X.Q., Fan, X.J., “Sensitivity investigation of substrate thickness and reflow profile on wafer level film failures in 3D chip scale packages by finite element modeling”, Proceedings of the Electronic Components and Technology Conference. ECTC ‘07, 57th, Sparks, NV, USA, May 29 2007–June 1 2007, pp. 242–248, 2007.

    Google Scholar 

  8. Xie, B., Shi, X.Q., Fan, X.J., “Accelerated moisture sensitivity test methodology for stacked-die molded matrix array package”, Proceedings of EPTC, Electronic Packaging Technology Conference, Singapore, 2007.

    Google Scholar 

  9. Park, C.E., Han, B.J., Bair, H.E., “Humidity effect on adhesion strength between solder ball and epoxy underfills,” Polymer, 38(15), 3811–3818, 1997.

    Article  Google Scholar 

  10. Kuhl, A., Qu, J.M., “A technique to measure interfacial toughness over a range of phase angles,” Journal of Electronic Packaging, 122, 147–151, 2000.

    Article  Google Scholar 

  11. Rice, J.R., “Elastic fracture mechanics concepts for interfacial cracks,” Journal of Applied Mechanics, 55, 98–10, 1988.

    Article  Google Scholar 

  12. Dunders, J., “Edge-bonded dissimilar orthogonal elastic wedges,” Journal of Applied Mechanics, 36, 650–652, 1969.

    Article  Google Scholar 

  13. Owen, D.R.J., Fawkes, A.J., Engineering Fracture Mechanics: Numerical Methods and Applications. Swansea, UK: Pineridge Press, pp. 43, 1983.

    Google Scholar 

  14. Williams, M.L., “The stresses around a fault of crack in dissimilar media,” Bulletin of the Seismological Society of America, 49, 199–204, 1959.

    MathSciNet  Google Scholar 

  15. Shi, X.Q., Wang, Z.P., Pickering, J.P., “A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages,” Microelectronics Reliability, 43, 1105–1115, 2003.

    Article  Google Scholar 

  16. Post, D., Han, B., Ifju, P., High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials. New York, NY: Springer, 1994.

    Book  Google Scholar 

  17. Bruck, H.A., McNeill, S.R., Sutton, M.A., Peters, W.H., “Digital image correlation using Newton-Raphson method of partial differential correlation,” Experimental Mechanics, 29, 261–267, 1989.

    Article  Google Scholar 

  18. Shi, X.Q., Zhang, Y.L., Zhou, W., “Determination of fracture toughness of polymer/inorganic interface with digital image speckle correlation technique,” IEEE Transactions on Components & Packaging Technologies, 30(1), 101–109, 2007.

    Article  MathSciNet  Google Scholar 

  19. Shi, X.Q., Pang, H.L.J., Zhang, X.R., Liu, Q.J., Ying, M., “In-situ micro-digital image speckle correlation technique for characterization of materials’ properties and verification of numerical models,” IEEE Transactions on Components and Packaging Technologies, 27(4), 659–667, 2004.

    Article  Google Scholar 

  20. Zhang, W., Wu, D., Su, B., Hareb, S.A., Lee, Y.C., Materson, B.P., “The effect of underfill epoxy on warpage in flip chip assemblies,” IEEE Transactions on Components and Packaging Manufacturing Technologies, Part A, 21, 323–328, 1998.

    Article  Google Scholar 

  21. Shi, X.Q., Wang, Z.P., Pang, H.L.J., Zhang, X.R., “Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens”, Polymer Testing, 21, 725–733, 2002.

    Article  Google Scholar 

  22. Shi, X.Q., Zhang, Y.L., Zhou, W., “Reliability study of underfill/chip interface with multifunctional micro-moiré interferometry system,” Microelectronics Reliability, 46(2–4), 409–420, 2006.

    Google Scholar 

  23. Kook, S.Y., Snodgrass, J.M., Kirtikar, A., Dauskardt, R.H., “Adhesion and reliability of polymer/inorganic interfaces,” Journal of Electronic Packaging, 120, 328–334, 1998.

    Article  Google Scholar 

  24. Hutchinson, J.W., Suo, Z.G., “Mixed mode cracking in layered materials,” Advances in Applied Mechanics, 29, 63–191, 1992.

    Article  MATH  Google Scholar 

  25. Kwei, T.K., “Strength of epoxy polymer I – effect of chemical structure and environmental conditions”, Journal of Applied Polymer Science, 10, 1647, 1966.

    Article  Google Scholar 

  26. Xiao, G.Z., Shanahan, W.E.R., “Swelling of DGEBA/DDA epoxy resin during hygrothermal aging,” Polymer, 39(14), 3253–3260, 1998.

    Article  Google Scholar 

  27. Crank, J., The Mathematics of Diffusion, 2nd ed. Oxford: Oxford University Press, pp. 477, 1975.

    Google Scholar 

  28. Wang, J., Qian, Z., Zou, D., Liu, S., “Creep behavior of a flip-chip package by both FEM modeling and real time moiré interferometry,” Journal of Electronic Packaging, 120, 179–185, 1998.

    Article  Google Scholar 

  29. Sung, Y., Goh, J.S., Yang, J.C., “Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking testing,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 20(3), 247–254, 1997.

    Article  Google Scholar 

  30. Gurumurthy, C.K., Kramer, E.J., Hui, C.Y., “Water-assisted sub-critical crack growth along an interface between polyimide passivation and epoxy underfill,” International Journal of Fracture, 109, 1–28, 2001.

    Article  Google Scholar 

  31. Zhang, Y.L., Shi, X.Q., Zhou, W., “Determination of fracture toughness of underfill/chip interface with digital image speckle correlation technique”, Proceedings of ECTC, Las Vegas, USA, vol. 1, pp. 140–147, 2004.

    Google Scholar 

  32. Kinloch, A.J., Adhesion and Adhesives: Science and Technology. New York, NY: Chapman and Hall, pp. 56–96, 1987.

    Book  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Applied Science & Technologies Research Institute (ASTRI) 5/F, Photonics Center, Science Park, Shatin, Hong Kong, People’s Republic of China

    X. Q. Shi

  2. Department of Mechanical Engineering, Lamar University, PO Box 10028, Beaumont, TX, 77710, USA

    X.J. Fan

  3. School of Mechanical & Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, Singapore, 639798

    Y.L. Zhang & W. Zhou

Authors
  1. X. Q. Shi
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. X.J. Fan
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Y.L. Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. W. Zhou
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to X. Q. Shi .

Editor information

Editors and Affiliations

  1. Dept. Mechanical Engineering, Lamar University, Beaumont, 77710, USA

    X.J. Fan

  2. ERS Co., Alvina Court 727, Los Altos, 94024, USA

    E. Suhir

Rights and permissions

Reprints and permissions

Copyright information

© 2010 Springer Science+Business Media, LLC

About this chapter

Cite this chapter

Shi, X.Q., Fan, X., Zhang, Y., Zhou, W. (2010). Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques. In: Fan, X., Suhir, E. (eds) Moisture Sensitivity of Plastic Packages of IC Devices. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5719-1_6

Download citation

  • DOI: https://doi.org/10.1007/978-1-4419-5719-1_6

  • Published:

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4419-5718-4

  • Online ISBN: 978-1-4419-5719-1

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation