Abstract
In this chapter, hygroscopic swelling behavior of mold compounds is characterized by a novel experimental procedure using a whole-field displacement technique called moiré interferometry. Large variation in moisture content at the virtual equilibrium state is observed, while the coefficient of hygroscopic swelling does not vary significantly. An investigation on an actual package is also performed to determine hygroscopic swelling mismatch strains at the chip/mold compound interface. The results are compared with thermal expansion mismatch strains. The comparison reveals much higher hygroscopic swelling mismatch strains in the package, which must be considered for reliability assessment when it is subjected to environments where the relative humidity fluctuates.
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Stellrecht, E., Han, B., Pecht, M. (2010). Characterization of Hygroscopic Deformations by Moiré Interferometry. In: Fan, X., Suhir, E. (eds) Moisture Sensitivity of Plastic Packages of IC Devices. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5719-1_5
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DOI: https://doi.org/10.1007/978-1-4419-5719-1_5
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