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Moisture Sensitivity of Plastic Packages of IC Devices pp 279–299Cite as

Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices

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Abstract

In this chapter, continuum theory and application to moisture-induced failures of encapsulated IC devices are reviewed. A single spherical void subjected to internal vapor pressure and thermal stress is investigated within the context of finite-deformation theory. There is a critical surface traction which defines the occurrence of unstable void growth and rupture. When elastic–plastic model is applied, the critical surface traction is about two to three times of the yield stress of the polymer material, which has an initial void volume fraction from 1 to 5%. When hyperelastic model is used, the critical stress is one order higher than that predicted by the elastic–plastic model. The theoretical results obtained from hyperelastic model are consistent with experimental observations. In addition, a model study is presented in this chapter on unstable void growth at interface. The problem is simplified to be equivalent to a void problem with increased initial void volume fraction. The increased initial void volume fraction, induced by the degradation of interface adhesion due to moisture, lowers significantly the critical stress. Therefore, the interfacial delamination might occur. For a soft film, however, it is possible that cohesive rupture forms first. Vapor pressure effects are incorporated into a continuum description of stresses and strains with the Gurson–Tvergaard’s model. The void evolution rate equations are extended to an interface with considerations of interface debonding due to temperature and moisture effects. A rigid-plastic model is introduced to analyze package bulge, and the limit pressure that leads package to crack is obtained. The relationship between vapor pressure, encapsulation thickness, and the length of die pad is established. Last, under the general framework of continuum mechanics using homogenization, the governing equations for a polymer with moisture are developed. The new framework provides a systematic approach to perform full-field analysis for moisture-induced failures of encapsulated IC devices.

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Abbreviations

JEDEC:

Joint Electron Device Engineering Council

IPC:

Institute for Printed Circuits

BGA:

ball grid array

CSP:

chip scale package

QFP:

quad flat package

QFN:

quad flat non-lead package

FCBGA:

flip chip ball grid array

MSL:

moisture sensitivity level

IC:

integrated circuit

DMA:

dynamic mechanical analyzer

TMA:

thermo-mechanical analyzer

TGA:

thermogravimetric analyzer

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Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, Lamar University, PO Box 10028, Beaumont, TX, 77710, USA

    X.J. Fan & J. Zhou

  2. Philips LightLabs, Mathildelaan 1, 5611 BD, Eindhoven, The Netherlands

    G.Q. Zhang

  3. Delft University of Technology, Mekelweg 2, 2628 CD, Delft, The Netherlands

    G.Q. Zhang

  4. Department of Mechanical Engineering, Iowa State University, Ames, IA, 50011, USA

    A. Chandra

Authors
  1. X.J. Fan
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  2. J. Zhou
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  3. G.Q. Zhang
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  4. A. Chandra
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Corresponding author

Correspondence to X.J. Fan .

Editor information

Editors and Affiliations

  1. Dept. Mechanical Engineering, Lamar University, Beaumont, 77710, USA

    X.J. Fan

  2. ERS Co., Alvina Court 727, Los Altos, 94024, USA

    E. Suhir

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Fan, X., Zhou, J., Zhang, G., Chandra, A. (2010). Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices. In: Fan, X., Suhir, E. (eds) Moisture Sensitivity of Plastic Packages of IC Devices. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5719-1_11

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  • DOI: https://doi.org/10.1007/978-1-4419-5719-1_11

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