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Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications

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Abstract

A critical component in mm-wave applications is the electromagnetic interconnect between devices. At mm-wave frequencies it is necessary to consider reducing the losses arising from that of using conventional transmission lines such as stripline and microstrip. An interconnect that offers comparatively lower loss connections at mm-wave frequencies is the laminate waveguide (LWG) constructed in low-temperature cofired ceramic (LTCC) technology. The LWG has superior loss characteristics as compared to stripline. The LWG, which propagates a dominant TE10 wave mode, approximates a dielectrically filled rectangular waveguide where the top and bottom walls are pattern printing and the sidewalls of the waveguide are tightly spaced via fences.

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References

  1. D. Liu, U. Pfeiffer, J. Grzyb, and B. Gaucher, eds. “Advanced Millimeter-Wave Technologies”, John Wiley & Sons.

    Google Scholar 

  2. H. Uchimura, T. Takenoshita, and M. Fujii, “Development of a Laminated Waveguide,” IEEE Transactions on Microwave Theory and Techniques, vol. 46, no. 12, pp. 2438–2443, December 1998.

    Article  Google Scholar 

  3. F. Xu, and K. Wu, “Guided-Wave and Leakage Characteristics of Substrate Integrated Waveguide,” IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 1, pp. 66–73, January 2005.

    Article  Google Scholar 

  4. D. Stephens, P.R. Young, and I.D. Robertson, “Millimeter-Wave Substrate Integrated Waveguides and Filters in Photoimageable Thick-Film Technology,” IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 12, pp. 3832–3838, December 2005.

    Article  Google Scholar 

  5. H. Uchimura, and T. Takenoshita, “A Ceramic Planar 77 GHz Antenna Array,” 1999 IEEE MTT-S International Microwave Symposium Digest, vol. 2, pp. 453–456, June 13–19, 1999.

    Google Scholar 

  6. H. Uchimura, N. Shino, and K. Miyazato, “Novel Circular Polarized Antenna Array Substrates for 60 GHz-band,” IEEE MTT-S International Microwave Symposium Digest, 2005, pp. 1875–1878, June 12–17, 2005.

    Google Scholar 

  7. Y. Huang, K. Wu, D. Fang, and M. Ehlert, “An Integrated LTCC Millimeter-Wave Planar Array Antenna With Low-Loss Feeding Network,” IEEE Transactions on Antennas and Propagation, vol. 53, no. 3, pp. 1232–1234, March 2005.

    Article  Google Scholar 

  8. M. Clenet, J. Litzenberger, D. Lee, S. Thirakoune, G.A. Morin, and Y. Antar, “Laminated Waveguide as Radiating Element for Array Applications,” IEEE Transactions on Antennas and Propagation, vol. 54, no. 5, pp. 1481–1487, May 2006.

    Article  Google Scholar 

  9. J. Hirokawa, and M. Ando, “Single-Layer Feed Waveguide Consisting of Posts for Plane TEM Wave Excitation in Parallel Plates,” IEEE Transactions on Antennas and Propagation, vol. 46, no. 5, pp. 625–630, May 1998.

    Article  Google Scholar 

  10. J. Aguirre, H. Pao, H. Lin, P. Garland, D. O’Neill, and K. Horton, “An LTCC 94 GHz Antenna Array” IEEE Antennas and Propagation Symposium, San Diego, 2008

    Google Scholar 

  11. S. Park, Y. Okajima, J. Hirokawa, and M. Ando, “A Slotted Post-Wall Waveguide Array With Interdigital Structure for 45° Linear and Dual Polarization,” IEEE Transactions on Antennas and Propagation, vol. 53, no. 9, pp. 2865–2871, September 2005.

    Article  Google Scholar 

  12. S. Ramo, J.R. Whinnery, and T. Van Duzer. “Fields and Waves in Communication Electronics”, John Wiley and Sons.

    Google Scholar 

  13. Y. Huang, and K. Wu, “A Broadband Integrated LTCC Laminated Waveguide to Metallic Waveguide Transition,” IEEE MTT-S International Microwave Symposium Digest, 2003, pp. 2237–2240, 8–13 June, 2003.

    Google Scholar 

  14. Y. Huang, K. Wu, and M. Ehlert, “An IntegratedLTCC Laminated Waveguide-to-Microstrip Line T-Junction,” IEEE Microwave and Wireless Components Letters, vol. 13, no. 8, pp. 338–339, August 2003.

    Article  Google Scholar 

  15. P. Garland, J. Aguirre, H. Pao, H. Lin, D. O’Neill, and K. Horton, “Manufacturing Challenges for a W-band Laminated Waveguide Phased Array” IEEE Antennas and Propagation Symposium, San Diego, 2008.

    Google Scholar 

  16. D.M. Pozar, “Microwave Engineering”, Addisen-Wesley.

    Google Scholar 

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Acknowledgments

The author gratefully acknowledges Dr. Billy C. Brock of Sandia National Labs, Ms. Iris Labadie of Kyocera America Inc., and Mr. Ed Graddy of Ferro Inc. for critically reviewing this chapter.

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Correspondence to Jerry Aguirre .

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Aguirre, J. (2010). Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications. In: Kuang, K., Kim, F., Cahill, S. (eds) RF and Microwave Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0984-8_8

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  • DOI: https://doi.org/10.1007/978-1-4419-0984-8_8

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