Abstract
The thirst for higher data rates and greater bandwidth has resulted in increased interest in millimeter-wave systems as a means for local and wider area information transport. At the same time there is a real need for lower cost and more compact systems. These requirements have led to the development of a highly integrated millimeter-wave System In Package (SIP), which operates beyond 40 GHz. This solution uses low cost ceramic packaging as well as optimized interconnects and transitions to allow for wide-band electrical performance. This paper will present details on the functionality, electrical performance and packaging used to realize this solution.
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Sturdivant, R. (2010). Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies. In: Kuang, K., Kim, F., Cahill, S. (eds) RF and Microwave Microelectronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0984-8_1
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DOI: https://doi.org/10.1007/978-1-4419-0984-8_1
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