Abstract
An ever-increasing number of transistors are being placed onto silicon dies in both small and large computing systems. The shrinking of the transistors on these chips has allowed an increasingly large amount of computing power to be brought to smaller and smaller devices. There have been many advances in computing architectures that have allowed this pace to continue. Examples can be seen through the development of combining numerous application processors into MPSoCs (multiprocessor systems on a chip) as well as techniques like hardware multithreading. Through the increase in both complexity of chip designs and the number of those chips occupying a single die, our computers now require greater bandwidth to an ever increasing amount of system DRAM memory. By optimizing these systems with TSVs, one can alleviate this memory bottleneck while simultaneously reducing the overall energy consumption of the complete computing platform.
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Notes
- 1.
JEDEC, or Joint Electron Device Engineering Council, is an organization that defines standards for electronics, including DRAM module specifications such as timing and communications protocols. The goal is for interoperability of DRAM chips from different DRAM manufacturers in computing systems.
- 2.
A CODEC or a compressor–decompressor. The process of compressing transforms a multimedia stream into a more compact form for storage or transport. A decompressor performs the opposite operation, recreating an exact or similar version of the multimedia stream for display or additional processing.
- 3.
Transcoding is the process of converting a compressed stream of data into another compression format. Usually transcoding is done to satisfy a need, such as an opportunity to utilize a newer compression format that allows one to store data in a format with a higher compression ratio than before while maintaining a similar level of quality.
- 4.
This effect modifies the background of the image of the recipient of the phone call to make it appear three dimensional. For example, when the originator of the call moves her head as if to look around or behind the recipient, the background image is updated to provide the illusion of the depth.
- 5.
As an example, the JEDEC SSTL_25 standard sets V SS to 0 V, V TT to 1.25 V, and V DDQ to 2.5 V.
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Carlson, T., Facchini, M. (2011). 3D Stacking of DRAM on Logic. In: Papanikolaou, A., Soudris, D., Radojcic, R. (eds) Three Dimensional System Integration. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0962-6_8
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