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3D Through-Silicon Via Technology Markets and Applications

Chapter

Abstract

The drivers for through-silicon via (TSV) adoption can be divided into two major application areas. The first is products driven by form factor requirements. In some cases, this is also coupled with performance advantages. The second is high-performance computing, where the adoption of 3D TSV technology promises higher clock rates, lower power dissipation, and higher integration density. The technology will be adopted in many high-performance computing applications because it solves issues related to electrical performance, memory latency, power, and noise on and off the chip. For some applications, a high-bandwidth memory interface to the logic has been the main driver for the development of the technology [1].

Keywords

Field Programmable Gate Array Memory Latency NAND Flash CMOS Image Sensor Lower Power Dissipation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.TechSearch InternationalAustinUSA

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