Simulation-Assisted Design and Accelerated Insertion of Materials

  • D. L. McDowell
  • D. Backman


Significant advances have been realized in accelerating the insertion of new and improved materials into products within the compressed timeframe of design and prototyping using the emerging computational materials science modeling and systems-based information management and materials design strategies. Recent initiatives in the USA to strengthen the link between materials modeling and simulation, process route, and structure–property relations are discussed, with emphasis on the Accelerated Insertion of Materials (AIM) strategy, tools, and methods. The recent emphasis on Integrated Computational Materials Engineering (ICME), an emergent branch of AIM that is built upon integrating modeling and simulation with product development, is discussed in terms of its common ground with the notion of concurrent design of materials and products– materials design. Materials design includes multiscale modeling of hierarchical materials as an important component, but is much broader in scope. This distinction between materials design and multiscale modeling is considered in some detail, with emphasis on top-down requirements on material structure and performance to meet product requirements. Uncertainty is a ubiquitous aspect of materials design, regardless of whether design decisions are informed by experimental measurements, modeling, and simulation or other heuristics. Some emerging concepts for robust design of materials are briefly described, and challenges for the synthesis of modeling and simulation and materials design are outlined.


AIM ICME Materials design Modeling and simulation Multiscale modeling Top-down design 



The coauthors are grateful for funding that supported their collaboration in the DARPA AIM program (Dr. Leo Christodoulou, monitor). DLM also wishes to acknowledge support from the DARPA Synthetic Multifunctional Materials Program (Dr. Leo Christodoulou, monitor), the Center for Computational Materials Design (CCMD), a NSF I/UCRC jointly founded by Penn State and Georgia Tech (DLM Co-Director),, as well as support from DARPA/P&W Prognosis (Dr. Leo Christodoulou, DARPA and Dr. Robert Grelotti, P&W, monitors), and ONR D3D tools programs (Dr. Julie Christodoulou, government prime, with Drs.G.B. Olson and H. Jou at QuesTek as monitors). Dr. McDowell especially wishes to thank his many Georgia Tech colleagues (Systems Realization Laboratory faculty Professors F. Mistree and J.K. Allen, and former co-advised graduate students in materials design C.C. Seepersad, H.-J. Choi, and J.H. Panchal) for collaborating to develop first generation robust materials design concepts such as Type III robust design and IDEM reviewed in this chapter.


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© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.GWW School of Mechanical EngineeringGeorgia Institute of TechnologyAtlantaUSA

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