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Thermally Conductive Nanocomposites

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Nano-Bio- Electronic, Photonic and MEMS Packaging

Abstract

The heat dissipation problem is becoming a crucial barrier in the continuous process of electronic devices and systems miniaturization, and thermal interface materials play a key role in transport at all level microelectronics packaging. In this chapter, thermally conductive composites, as one of the main types of thermal interface materials are discussed. Such composites consist of the polymer base material matrix and thermally conducting filler. In modern bio- and micro-electronics, the thermal conductivity of the filler material ought to be as high as possible and its size—in the nanometer range. For this purpose, the nanosized particles of metals (mostly silver) or carbon allotropies (mostly carbon nanotubes) are used. Unfortunately, even when the fillers with thermal conductivity in the range of hundreds or more W/m×K are applied, the conductivity of nanocompostes elaborated currently are not higher than a few W/m×K. The analysis of heat transport in filled composites shows that the reason of such limitation of the heat transport is related with thermal contact resistance between filler’s particles. The way of the thermal conductivity improvement is discussed; however, in order to evaluate this progress correctly, the proper measurement methods have to be used. Currently there are many technical solutions to measure thermal conductivity which are based on either steady-state or transient techniques, but for relatively low thermal conductivity of nanocomposites, only few methods can be applied. Here the analysis of the thermal conductivity measurement is presented.

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  1. Faculty of Microsystem Electronics and Photonic, Wrocław University of Technology, Wrocław, Poland

    Jan Felba

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  1. School of Materials Science &, Georgia Institute of Technology, Ferst Drive NW., 771, Atlanta, 30332-0245, U.S.A.

    C.P. Wong

  2. School of Materials Science &, Georgia Institute of Technology, Ferst Drive NW., 771, Atlanta, 30332-0245, U.S.A.

    Kyoung-Sik Moon

  3. CH5-159, Intel Corporation, W. Chandler Blvd. 5000, Chandler, 85226, U.S.A.

    Yi (Grace) Li

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Felba, J. (2010). Thermally Conductive Nanocomposites. In: Wong, C., Moon, KS., Li, Y. (eds) Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0040-1_10

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