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Micromechanical Modeling of the Elastic Behavior of Multilayer Thin Films; Comparison with In Situ Data from X-Ray Diffraction

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IUTAM Symposium on Modelling Nanomaterials and Nanosystems

Part of the book series: IUTAM Bookseries ((IUTAMBOOK,volume 13))

Abstract

Our goal is to address the elastic stiffness of polycrystalline materials as the grain size decreases down to the nanometric scale. Tensile tests on W/Cu multilayers exhibiting various (nanometric) thicknesses have been carried out under synchrotron radiation. Analyses of X-ray diffraction data provide the average axial elastic strain in the two types of layers and along different crystallographic orientation. To interpret those results, we use a mean-field homogenization approach based on two scale transitions. The accuracy of this micromechanical model is compared to reference results obtained with a full-field approach in which a simple periodic microstructure is considered as for the grain distribution within each layer. Experimental data well match model predictions.

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Geandier, G. et al. (2009). Micromechanical Modeling of the Elastic Behavior of Multilayer Thin Films; Comparison with In Situ Data from X-Ray Diffraction. In: Pyrz, R., Rauhe, J.C. (eds) IUTAM Symposium on Modelling Nanomaterials and Nanosystems. IUTAM Bookseries, vol 13. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-9557-3_11

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