Surface-micromachined devices are typically contained in a volume specified by the area of the chip and the height of the thin-films used during fabrication. Even a very small chip will be several millimetres on a side. However, the total height of the thin-films will typically be measured in microns. Thus, surface-micromachined devices are quite constrained in this one direction1. This small vertical range can be a disadvantage.
KeywordsWafer Surface Microelectromechanical System Automate Assembly Manual Assembly Release Step
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