Abstract
The traditional role of mechanical analysis in electronic packaging had been reliability assessment of microelectronic and photonic devices at the final stage of development. The shrinking product development cycle time, however, has changed the role of mechanical analysis from a problem solving (passive) mode to a predictive (active) mode, where the mechanical analysis is performed for (1) design optimization and (2) reliability prediction of a new technology product at its conceptual stage of development. This dependency of product development on mechanical analysis has fostered increasing activity in mechanical experimentation, both for specific studies and for guidance of numerical modeling.
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References
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Han, B., 14. Characterization of Stresses and Strains in Microelectronic and Photonic Devices Using Photomechanics Methods, Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2006.
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Han, B. (2007). Recent Developments and Applications of Photomechanics Methods for Microelectronics Product Development. In: Gdoutos, E.E. (eds) Experimental Analysis of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-6239-1_7
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DOI: https://doi.org/10.1007/978-1-4020-6239-1_7
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-6238-4
Online ISBN: 978-1-4020-6239-1
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