Abstract
Recently, integration of LSI and IC has been developed dramatically because of miniaturization of electronics. So, the wet etching of copper foil plays an important role in the ultra-fine processing technology. In order to produce finer circuits efficiently, kinetics on the etching rate of copper foil in aqueous solutions must be clarified under turbulent flow condition.
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References
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Matsumoto, K., Takahashi, D., Matsumura, K., Suzuki, T., Taniguchi, S. (2007). Wet Etching Rate in the Cavity of Printed Circuit Board. In: Gdoutos, E.E. (eds) Experimental Analysis of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-6239-1_415
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DOI: https://doi.org/10.1007/978-1-4020-6239-1_415
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-6238-4
Online ISBN: 978-1-4020-6239-1
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