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Wet Etching Rate in the Cavity of Printed Circuit Board

  • Katsutoshi Matsumoto
  • Daiki Takahashi
  • Kazutoshi Matsumura
  • Takaharu Suzuki
  • Shoji Taniguchi
Conference paper

Abstract

Recently, integration of LSI and IC has been developed dramatically because of miniaturization of electronics. So, the wet etching of copper foil plays an important role in the ultra-fine processing technology. In order to produce finer circuits efficiently, kinetics on the etching rate of copper foil in aqueous solutions must be clarified under turbulent flow condition.

Keywords

Print Circuit Board Ferric Chloride Etching Rate Copper Foil Cavity Formation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    Matsumoto, K., Arai, H., Taniguchi, S. and Kikuchi, A., In Proceeding of the 38th Annual Conference of Metallurgist, Quebec, Canada, 1999, 183–191.Google Scholar
  2. 2.
    Matsumoto, K., Arai, H., Taniguchi, S. and Kikuchi, A., J. Japan Inst. Electronics Packaging, vol.5, 35–41, 2001.CrossRefGoogle Scholar
  3. 3.
    Matsumoto, K., Funahashi, S. and Taniguchi, S., In Proceeding of the 36th International Symposium on Microelectronics, Boston, USA, 2003, 345–350.Google Scholar

Copyright information

© Springer 2007

Authors and Affiliations

  • Katsutoshi Matsumoto
    • 1
  • Daiki Takahashi
    • 1
  • Kazutoshi Matsumura
    • 1
  • Takaharu Suzuki
    • 1
  • Shoji Taniguchi
    • 1
  1. 1.Tohoku UniversitySendaiJapan

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