Wet Etching Rate in the Cavity of Printed Circuit Board
Recently, integration of LSI and IC has been developed dramatically because of miniaturization of electronics. So, the wet etching of copper foil plays an important role in the ultra-fine processing technology. In order to produce finer circuits efficiently, kinetics on the etching rate of copper foil in aqueous solutions must be clarified under turbulent flow condition.
KeywordsPrint Circuit Board Ferric Chloride Etching Rate Copper Foil Cavity Formation
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