Abstract
Strain gauges made of copper plating foil are devised for measuring the elastic surface stress of machine parts in operation. The elastic stress is measured by observing slip bands in the bonded foil. Calibration studied by cyclic tension test with various frequencies, various stress ratios and different stress waveforms are performed on round steel bars with copper plating foil. It is verified that the relation between the threshold stress for the first appearance of slip bands and the number of cycles are not affected by the stress ratios and stress waveforms, but the frequency. Using a computer image-processing system, the density of slip bands in a microscopic image of the bonded foil is analyzed automatically and quantitatively.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Roark, R, J and W.C. Young., Formulas for Stress and Strain, 5th ed., New York, McGraw-Hill, 1975.599.
M. Sugiura, A. Arakawa, Y. Aoyama and M. Seika., In Proceeding of International Conference on advanced Technology in Experimental Mechanics, ATEM’03, Nagoya, Japan, 2003, CD-ROM.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer
About this paper
Cite this paper
Sugiura, M., Ozeki, R., Seika, M. (2007). An Application of Image-Processing to Stress Measurement by Copper Plating Foil (On the Effect of Frequency, Stress Ratio and Stress Waveform). In: Gdoutos, E.E. (eds) Experimental Analysis of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-6239-1_254
Download citation
DOI: https://doi.org/10.1007/978-1-4020-6239-1_254
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-6238-4
Online ISBN: 978-1-4020-6239-1
eBook Packages: EngineeringEngineering (R0)