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Dislocation-Assisted Grain Growth in Nanocrystalline Copper under Large Deformation

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Part of the book series: Solid Mechanics and its Applications ((SMIA,volume 144))

Abstract

Dislocation plasticity would conventionally induce textures in polycrystalline metals after a large deformation. We used parallel molecular dynamics (MD) to simulate the plastic deformation of nanocrystalline copper to an isochoric stretch up to 100% logarithmic strain. We found that the movements of partial dislocations that dominate the deformation process do not lead to texture formation. The grain size distribution becomes extremely inhomogeneous. By observing the structural evolution, we demonstrate that partial dislocations assisted the grain growth that destroys the texture.

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Ma, X.L., Wang, H.T., Yang, W. (2007). Dislocation-Assisted Grain Growth in Nanocrystalline Copper under Large Deformation. In: Bai, Y.L., Zheng, Q.S., Wei, Y.G. (eds) IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials. Solid Mechanics and its Applications, vol 144. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-5624-6_2

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  • DOI: https://doi.org/10.1007/978-1-4020-5624-6_2

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-5623-9

  • Online ISBN: 978-1-4020-5624-6

  • eBook Packages: EngineeringEngineering (R0)

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