Modern Interface Methods for Semiconductor Process Simulation
The manufacture of semiconductor devices may include dozens of process steps, all delicately choreographed to produce a functioning, reliable, and efficient device. These steps, such as photolitography, etching and deposition, act to shape and mold the device, replete with various metals, insulators, and interconnects. As one might guess, a trial and error approach to determine a repeatable and reliable recipe is not inexpensive. Numerical simulations which capture the essential details of these processes have a valuable role to play.
KeywordsCombustion Phosphorus Dioxide Argon Mold
Unable to display preview. Download preview PDF.
- J. Sethian, “Numerical methods for propagating fronts,” In: P. Concus and R. Finn (eds.), Variational Methods for Free Surface Interfaces, Springer-Verlag, New York, pp. 66–80, 1987.Google Scholar