Texture Evolution During Thin Film Deposition
The modeling of materials processing intrinsically spans multiple scales, in terms of both space and time. The modeling of thin film deposition, together with the accompanying texture evolution, spans 15 orders of magnitude in time, from fundamental atomic vibration period of 10−13 s to deposition duration of 102 s. This section describes challenging issues, critically presents existing approaches, and offers an outlook of future developments in the modeling of thin film texture evolution.
KeywordsMigration Expense Bors
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- R.A. Powell and S. Rossnagel, Thin Films: PVD for Microelectronics, Academic Press, New York, 1999.Google Scholar
- M.J. Brett, S.K. Dew, and T. Smy, Thin Films: Modeling of Film Deposition for Microelectronic Applications, S. Rossnagel, ed., Academic Press, New York, 1996.Google Scholar
- F. Baumann and G.H. Gilmer, “3D modeling of sputter and reflow processes for interconnect metals,” IEDM Technical Digest, 89, 1995.Google Scholar
- H. Huang and L.G. Zhou, “Atomistic simulator of polycrystalline thin film deposition in three dimensions,” J. Compu. Aided Mater. Des., in press, 2005.Google Scholar