Scanning Acoustic Microscopy Covering a Wide Temperature Range: SAM(T)

  • P. Rajamand
  • R. Tilgner
  • R. Schmidt
  • J. Baumann
  • P. Klofac
  • M. Rothenfusser
  • B. Granz
Conference paper
Part of the Acoustical Imaging book series (ACIM, volume 27)


The reliability of plastic encapsulated microchips is strongly influenced by temperature. Scanning Acoustic Microscopy (SAM) is established as an indispensable non-destructive analytical tool to evaluate mechanical failures such as cracks or delaminations imposed by reliability tests within electronic components. They are investigated by SAM at room temperature after a treatment by thermal stress. Thus, the very failure mechanisms due to the thermal effects remain in dark. In this work we present for the first time the growth and change of delaminations in integrated circuit devices under thermal stress from -60°C to 150°C in a real temperature manner. For this SAM(T) was established, a SAM with the particular feature to change the temperature of the object and to record its changes online. This kind of results may be used as valuable input for future work on virtual reliability testing for microelectronics.


Packaging Technology Molding Compound Concave Curvature Acoustic Microscopy Speckle Interferometry 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media Dordrecht 2004

Authors and Affiliations

  • P. Rajamand
    • 1
  • R. Tilgner
    • 2
  • R. Schmidt
    • 2
  • J. Baumann
    • 3
  • P. Klofac
    • 3
  • M. Rothenfusser
    • 3
  • B. Granz
    • 4
  1. 1.Institut National Polytechnique de LorraineEcole Européenne d’Ingénieurs en Génie des MatériauxNancy CedexFrance
  2. 2.Infineon Technologies AGMunichGermany
  3. 3.Siemens AGMunichGermany
  4. 4.Siemens AGErlangenGermany

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