Experimental Study of the Printing of Solder Paste Using the Metal Blade Squeegee System
Competitive pressures to downsize equipment and to maximise circuit performance, combined with short product life cycles have catalysed the adoption of the Surface Mounting assembly technique. Surface mountable devices with 25-mil and 50-mil lead pitch are now widely used, and there is now a strong interest in sub-20 mil ultra-fine pitch devices. A major limitation to the miniaturisation trend is the spacing requirement for solder paste printing, and the need to deposit small and precise quantities of paste for the reflow soldering of these fine-pitch devices. To meet this solder paste printing challenge, a variety of printing methods, stencil fabrication and mounting techniques, paste formulations, pad design, board finish and squeegee systems are being developed. The effects of using the metal squeegee on solder paste print quality is investigated in this paper.
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