Abstract
The crossover has been developed to meet mechanical and electrical characteristics for a wide variety of integrated circuit needs. The preparation process utilises photolithographic techniques so that batch processing can be used to produce the crossovers economically. It is also fully compatible with the preparation and assembly techniques for tantalum and beam lead silicon-integrated circuits.
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© 1976 C. E. Jowett
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Jowett, C.E. (1976). Crossovers for Interconnections. In: The Engineering of Microelectronic Thin and Thick Films. Palgrave, London. https://doi.org/10.1007/978-1-349-02684-5_9
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DOI: https://doi.org/10.1007/978-1-349-02684-5_9
Publisher Name: Palgrave, London
Print ISBN: 978-1-349-02686-9
Online ISBN: 978-1-349-02684-5
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